For Release: April 6, 1998
Altera Announces New FineLine BGA Package for High Density PLDs
- Reveals New Form Factor with 1.0-mm Ball Pitch
- Requires Less than Half the Board Space of Standard BGA
- Ideal for Users of High-Density Programmable Logic
San Jose, Calif., April 6, 1998--Altera Corporation (Nasdaq: ALTR) today revealed a new form factor ball-grid array (BGA) solution for users of high density programmable logic devices called the FineLine BGA™package. The new format offers lower cost and requires less than half the board space of standard BGAs currently employed for PLDs. The 1.0-mm ball pitch of the FineLine BGA package allows implementation of 256 pins (balls) in only 17 square mm, the same amount of space consumed by a 100-pin TQFP package. A 672-ball FineLine BGA package is implemented in the same space as a 256-ball standard BGA. The efficient structure of the FineLine BGA package is reflected in lower board and package costs as compared to other packaging solutions.
The need for high pin-count devices is driven by the I/O requirements of high density logic. Altera's current MAX® and FLEX® PLD families will extend to 250,000 logic gates and the upcoming Raphael PLD family will reach two million gates. Traditional QFP packages are difficult to handle as pin pitch shrinks; in packages of more than 240 pins, handling issues become paramount. BGA packaging strategy will be increasingly important as logic devices reach new density levels. Dataquest estimates that design starts of devices supplied in BGA packages grew fifty percent during 1997, accounting for nearly 30% of ASIC designs.
FineLine BGA Package Fits Standard Engineering & Manufacturing Flow
The FineLine BGA package has the same engineering design flow and manufacturing flow as standard BGAs, preventing disruption during board design or manufacturing process for the customer, while achieving significant board space savings. In addition, the FineLine BGA package line conforms to JEDEC BGA specifications. Altera will continue to provide a wide variety of options to its customers, including standard BGA packaging, but now offers a new level of board space efficiency and reduced cost with the FineLine BGA packaging solution.
Altera Leadership in Technology Development of FineLine BGA Package
Altera product development engineers developed the FineLine BGA package to better serve the needs of high density PLD designers. At introduction of the 1.0-mm ball pitch FineLine BGA package, work has already begun on a 0.8-mm ball pitch package, with the intention to take the technology to 0.5-mm ball pitch. Already a leader in high density programmable logic solutions, Altera is establishing its leadership in BGA packaging strategy as well.
Altera anticipates that its FineLine BGA package will begin shipping with the 100k-gate FLEX EPF10K100A device in the next quarter. This will be followed by FineLine BGA packaging introductions in Altera's MAX 7000A and FLEX 10KE device families in the second half of 1998.
Safe Harbor Notice
This press release contains "forward looking statements" which are made pursuant to the safe harbor provisions of the Private Securities Litigation Reform Act of 1995. Forward looking statements are generally preceded by words such as "expects," "believes," "anticipates," "projects," or "intends." Investors are cautioned that all forward-looking statements in this release involve risks and uncertainty, including without limitation the risk that planned products will not be introduced as currently anticipated. Please refer to the Company's Securities and Exchange Commission filings, copies of which are available from the Company without charge, for further information.
About Altera
Altera Corporation, founded in 1983, is a worldwide leader in high-performance, high-density programmable logic devices and associated computer aided engineering (CAE) logic development tools. Programmable logic devices are semiconductor chips that offer on-site programmability to customers. The chips are programmed using tools that run on personal computers or engineering work stations. User benefits include ease of use, lower risk, and fast time-to-market. The company offers the broadest line of CMOS programmable logic devices
that address high-speed, high-density, and low-power applications. Altera products serve a broad range of markets, including telecommunications, data communications, computers, and industrial applications. Altera common stock is traded on the Nasdaq Stock Market under the symbol ALTR. More information on Altera can be obtained on the worldwide web at http://www.altera.com.
Editor Contact:
Rhondalee Rohleder
Director of Communications
Altera Corporation
(408) 544-8296
E-mail: rrohlede@altera.com
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