| What: |
Altera Corporation (NASDAQ: ALTR) will be hosting the High-Speed Serial Interconnect Seminar to help designers overcome the challenges of building high-speed serial link interconnects for next-generation communications and computer systems. Attendees will learn about the latest principles, design rules, tools, and technology options from leading industry experts such as Dr. Eric Bogatin, the president of Bogatin Enterprises, and CTO of IDI. A lecturer, and author of four books and over 200 papers on signal integrity and interconnect design, Dr. Bogatin will deliver the keynote address entitled “A Designer’s Survival Guide to High-Speed Serial Link Interconnects.” Presentations will also be delivered by industry experts from Tyco, Teradyne, Sanmina-SCI and Altera addressing selection and design processes pertinent to connectors, transceivers, chip-to-chip communication, protocols, and boards for multi-gigabit serial data rates.
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| Speakers: |
Dr. Eric Bogatin
President
Bogatin Enterprises, and
CTO
IDI
John D’Ambrosia|
Manager of Semiconductor Relations
Tyco Electronics, Tyco
Gautam Patel
Signal Integrity Engineer
Teradyne
Jim Tavacoli
Senior Director of Component Product Planning
Altera Corporation
Franz Gisin
Director of Backplane Design Technology and Signal Integrity Design
Sanmina-SCI
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