Altera's Cyclone® FPGA family provides the benefits of programmable logic at price points competitive with ASICs and ASSPs. Cyclone FPGAs are built from the ground up on a cost-optimized all-layer-copper 1.5-V SRAM process and based on extensive input from hundreds of customers. These low-cost devices provide high-volume application-focused features such as embedded memory, external memory interfaces, and clock management circuitry.
Table 1 outlines the Cyclone FPGA family members, features, and availability. Table 2 shows an overview of Cyclone device packaging and I/O pin counts. Table 3 shows the appropriate configuration devices to use for Cyclone FPGAs. Table 4 shows industrial temperature support for Cyclone FPGAs.
| Table 1. Cyclone FPGA Family Overview | |||||
| Feature | EP1C3 | EP1C4 | EP1C6 | EP1C12 | EP1C20 |
|---|---|---|---|---|---|
| LEs | 2,910 | 4,000 | 5,980 | 12,060 | 20,060 |
| M4K RAM Blocks (4 Kbits + Parity) | 13 | 17 | 20 | 52 | 64 |
| Embedded Memory (Kbits) | 59 | 77 | 90 | 234 | 288 |
| PLLs | 1 | 2 | 2 | 2 | 2 |
| Maximum User I/O Pins | 104 | 301 | 185 | 249 | 301 |
| Differential Channels | 34 | 129 | 72 | 103 | 129 |
| Availability | Buy Now | Buy Now | Buy Now | Buy Now | Buy Now |
| Industrial and Automotive Temperature | Yes (1) | Yes | Yes | Yes | Yes |
- The EP1C3 device is also available in automotive-grade versions, which support an automotive temperature range of -40°C to +125°C.
| Table 2. Cyclone FPGA Device Package and Maximum User I/O Pins | |||||
| Package Size (mm x mm) | EP1C3 | EP1C4 | EP1C6 | EP1C12 | EP1C20 |
|---|---|---|---|---|---|
| 100-Pin TQFP (1) (16 x 16) |
65 | ||||
| 144-Pin TQFP (22 x 22) |
104 | 98 | |||
| 240-Pin PQFP (2) (32 x 32) |
185 | 173 | |||
| 256-Pin FineLine BGA (3) (17 x 17) |
185 | 185 | |||
| 324-Pin FineLine BGA (19 x 19) |
249 | 249 | 233 | ||
| 400-Pin FineLine BGA (21 x 21) |
301 | 301 | |||
Notes:
1. TQFP = thin quad flat pack
2. PQFP = plastic quad flat pack
3. BGA = ball-grid array

