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China RoHS

In response to China's promulgation of the "Management Methods for Controlling Pollution Caused by Electronic Information Products Regulation", also known as China RoHS, Altera is providing information on controlled substances contained in our products.

Altera has divided its products into six categories based on the IC packaging. However, if you do not know the IC packaging of the product, type in the part number in the search query on the top of this page. If it is a valid part number, then the search result returns the link to the package outline under the Pin & Package column.

  • Lead-frame packages include the following: PQFP, TQFP, RQFP, SOIC, and PLCC.
  • BGA packages include the following: BGA, FBGA, HBGA, MBGA, and UBGA.
  • The package outline indicates whether the BGA package has a wire bond or flip chip option.
  • A lead-free part number is denoted by the suffix "N".

Please note that EU RoHS has different requirements, scope, and exemptions than China RoHS. Therefore, information provided on this page should not be used for determining EU RoHS compliancy.

If you have any questions, please contact customer-quality@altera.com.

Download the latest version of Adobe Acrobat Reader
Title Doc Version Release Date File Size Document Part Number
China RoHS
BGA (Flip-chip) Package, Leaded (Pb)1.1Mar 2007118 KBCR-01004-1.1
BGA (Flip-chip) Package, Lead-free (Pb-free)1.1Mar 2007120 KBCR-01006-1.1
BGA (Wire-bond) Package, Leaded (Pb)1.1Mar 2007115 KBCR-01003-1.1
BGA (Wire-bond) Package, Lead-free (Pb-free)1.1Mar 2007115 KBCR-01005-1.1
Lead-framed Package, Leaded (Pb)1.1Mar 2007114 KBCR-01001-1.1
Lead-framed Package, Lead-free (Pb-free)1.1Mar 2007115 KBCR-01002-1.1

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