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Customer Advisories, Process Change Notifications & Product Discontinuance Notifications
The following customer notifications are available on the Altera web site in Adobe Acrobat format.
Customer Notifications Subscription
If you would like to receive customer notifications by e-mail, please subscribe to our customer notification mailing list.
| Process Change Notifications |
| Title |
Release Date |
File Size |
| PCN 0805 Rev 1.1.0 Wafer Fabrication Site Change for Serial Configuration Devices
| Apr 2008 | 318 KB |
| PCN 0803 Package-Lid Stiffener Change for the Stratix Flip-Chip Family
| Mar 2008 | 69 KB |
| PCN 0802 Additional TSMC Wafer Fabrication Site for Cyclone III FPGAs
| Feb 2008 | 23 KB |
| PCN 0714 Rev 1.2.0 Assembly Plant Change for PQFP and TQFP Packages
| Jan 2008 | 77 KB |
| PCN 0801 Alternative Manufacturing Site for EPCS Family
| Jan 2008 | 25 KB |
| PCN 0715 Rev 1.1.1 Alternate Kyocera Substrate for Flip-Chip Packages
| Jan 2008 | 81 KB |
| PCN 0716 Additional TSMC Wafer Fabrication Site for Stratix GX FPGAs
| Nov 2007 | 23 KB |
| PCN 0708 Rev 1.1.0 Encapsulant Material Change for BGA Pb-Free Packages
| Oct 2007 | 29 KB |
| PCN 0712 Mold Compound Changes for BGA, UBGA, MBGA and FBGA Packages
| Oct 2007 | 86 KB |
| PCN 0702 Rev 1.2.0 Mold Compound Change for PQFP, PDIP, and RQFP Packages
| Sep 2007 | 97 KB |
| PCN 0710 Discontinuance of QFP Carriers for MAX 7000 Devices
| Jul 2007 | 27 KB |
| PCN 0513 Rev 1.1.1 Additional TSMC Wafer Fabrication Site
| May 2007 | 26 KB |
| PCN 0707 Sealing Glass Change for Ceramic Dual In-Line Package Assembled in the Philippines
| Mar 2007 | 84 KB |
| PCN 0701 EPCS16SI16N Process Change
| Jan 2007 | 72 KB |
| PCN 0412 Rev01 FineLine BGA Substrate Second Source (Kinsus)
| Jul 2006 | 18 KB |
| PCN 0602 Mold Compound Change for Cyclone II PQFP & TQFP Packages
| Apr 2006 | 32 KB |
| PCN 0603 Cyclone II Family M4K Memory Block Modification
| Apr 2006 | 124 KB |
| PCN 0517 Introducing Kinsus BT Substrate for BGA 600 and 652 Packages
| Mar 2006 | 74 KB |
| PCN 0515 Mold Compound Change for FPGA Packages
| Jan 2006 | 40 KB |
| PCN 0516 Mold Compound Change For PBGA Packages
| Dec 2005 | 38 KB |
| PCN 0514 Manufacturing Changes on EPCS Family
| Oct 2005 | 34 KB |
| PCN 0512 Implementing Standard Sumitomo-G6000 Series Mold Compound for PLCC Packages
| Aug 2005 | 31 KB |
| PCN 0506 Addition of Intel Flash Memory as Source for EPC4, EPC8 & EPC16 Enhanced Configuration Devices
| Aug 2005 | 61 KB |
| PCN 0504 Standardized EME-G700 Series Mold Compound for QFP Packages
| Jul 2005 | 31 KB |
| PCN 0415 Additional Mold Compound for FBGA Packages from ASE Malaysia
| Nov 2004 | 11 KB |
| PCN 0414 Standardized EME-G700 Mold Compound for TQFP Packages
| Nov 2004 | 16 KB |
| PCN 0413 Additional Wafer Fabrication Site (Fab 14 )
| Jul 2004 | 19 KB |
| PCN 0410 Additional Assembly, Test, and FGI Location
| Jun 2004 | 20 KB |
| PCN 0411 Additional Test and Finished Goods Inventory Location
| Jun 2004 | 19 KB |
| PCN 0407 UFBGA 88 Package Substrate Change
| May 2004 | 11 KB |
| PCN 0404 Additional Mold Compound for TQFP 144 Package
| Mar 2004 | 11 KB |
| PCN 0310 Mold Compound Change for 100 Lead QFP Package
| Aug 2003 | 6 KB |
| PCN 0304 300 MM Wafer Schedule
| May 2003 | 14 KB |
| PCN 0216 New Wafer Fabrication Source
| Nov 2002 | 55 KB |
| PCN 0214 Copper Lid for Selected Altera BGA and FineLine BGA Packages
| Oct 2002 | 13 KB |
| PCN 0119 ASAT Hong Kong will change the FineLine BGA package molding compound from Shin Etsu to Nitto HC-100
| Nov 2001 | 13 KB |
| PCN 0116 Amkor Korea will be added as a second source for FineLine BGA packages currently assembled in ASAT, Hong Kong
| Oct 2001 | 10 KB |
| PCN 0114 Configuration Device Flash Memory Supply Source Addition
| Aug 2001 | 9 KB |
| PCN 0113 FineLine BGA and QFP Package Assembly Site Addition
| Aug 2001 | 10 KB |
| PCN 0109 ACEX 1K Device Process Improvement
| Jan 2001 | 9 KB |
| PCN 0010 MAX 3000A Device Process Transition
| Nov 2000 | 9 KB |
| PCN 0008 MAX 7000AE Device Process Transition
| Sep 2000 | 12 KB |
| PCN 0005 EP20K400 Device Process Migration
| Mar 2000 | 11 KB |
| PCN 9918 EPM7064 & EPM7064S Additional Source of Supply
| Dec 1999 | 9 KB |
| PCN 9915 EPF10K50V Device Process Transition
| Aug 1999 | 13 KB |
| PCN 9911 EPF10K50E And EPF10K200E Device Process Migration
| Jun 1999 | 13 KB |
| PCN 9903 EPF6010A, EPF6016A, and EPF6024A devices transition to a 0.3-micron process at WaferTech
| Jan 1999 | 16 KB |
| PCN 9901 FLEX 10K and FLEX 6016 devices transition to a 0.42-micron process at WaferTech
| Jan 1999 | 18 KB |
| PCN 9810 EPF10K50V, EPF10K10A, EPF10K30A, and EPF10K100A devices move to a 0.3-micron process
| Aug 1998 | 15 KB |
| PCN 9805 Additional source of supply for FLEX 10K and FLEX 6000 products
| May 1998 | 19 KB |
| PCN 9802 EPC1064 and EPC1213 Devices
| Feb 1998 | 21 KB |
| PCN 9703 MAX 7000 & MAX 9000
| Feb 1997 | 85 KB |
| PCN 9702 Transition Schedule Update EPM7256E
| Feb 1997 | 84 KB |
| PCN 9616 Assembly & Test Site Addition
| Sep 1996 | 86 KB |
| PCN 9619 EPM7192E & EPM7256E Devices
| Sep 1996 | 89 KB |
| PCN 9612 Test & Shipment Site Addition
| Jun 1996 | 81 KB |
| PCN 9604 MAX 9000 devices transitioned to a 0.65 micron process
| Mar 1996 | 84 KB |
| PCN 9510 Transition of Classic devices to a 0.65-micron process
| Oct 1995 | 89 KB |
| PCN 9509 Preliminary reliability data for the 8" 0.6-micron FLEX 8000A devices
| Sep 1995 | 85 KB |
| PCN 9514 Additional source of supply for MAX 7000 devices
| Jun 1995 | 82 KB |
| PCN 9501 Reliability data and transition dates for the EPM7032 assembled in ASE Penang
| Jan 1995 | 150 KB |
| PCN 9407 MAX 5000 to transition from a 0.8-micron EPROM process to a 0.65-micron EPROM process, 1994
| Jul 1994 | 96 KB |
| Product Discontinuance Notices |
| Title |
Release Date |
File Size |
| PDN 0704 Rev 1.1.0 Altera will be discontinuing the EPCS16SI16N ordering code
| Jan 2008 | 17 KB |
| PDN 0711 Altera will be discontinuing select APEX 20KC, APEX II, FLEX 8000, MAX 7000B, MAX 9000, and Excalibur ordering codes
| May 2007 | 19 KB |
| PDN 0706 Rev 2 Altera will be discontinuing select APEX 20K, APEX II, FLEX 8000, MAX 9000, and Excalibur ordering codes
| Feb 2007 | 21 KB |
| PDN 0705 Altera will be discontinuing the EPM7096 products
| Feb 2007 | 16 KB |
| PDN 0703 Altera will be discontinuing the PL-APU ordering code
| Feb 2007 | 12 KB |
| PDN 0610: Altera will be discontinuing select programming adapter ordering codes
| Dec 2006 | 17 KB |
| PDN 0609: Altera will be discontinuing the PL-MASTERBLASTER ordering code
| Dec 2006 | 12 KB |
| PDN 0605 Altera will be discontinuing the remaining Classic device ordering codes
| Jul 2006 | 19 KB |
| PDN 0604 Altera will be discontinuing select Classic device ordering codes
| Jun 2006 | 61 KB |
| PDN 0518 Altera will be discontinuing select APEX II, APEX 20K, APEX 20KC, APEX 20KE,Classic, FLEX 8000, MAX 3000A, MAX 7000, MAX 7000B, and MAX 7000S ordering codes
| Dec 2005 | 28 KB |
| PDN0510 Altera will be discontinuing select APEX 20K, APEX 20KC, APEX 20KE, APEX II, Classic, Configuration Device, FLEX 10KA, FLEX 10KE, FLEX 6000, FLEX 8000, MAX 7000, MAX 7000A, MAX 7000B, MAX 7000S, and MAX 9000 ordering codes
| Jul 2005 | 52 KB |
| PDN 0509 Altera will be discontinuing select Classic and MAX 9000 ordering codes
| Jun 2005 | 19 KB |
| PDN 0508 Altera will be discontinuing EPM7256A ordering codes
| Apr 2005 | 18 KB |
| PDN 0507 Altera will be discontinuing EPM7128A ordering codes
| Apr 2005 | 19 KB |
| PDN 0409 Altera has discontinued the ARM Developer Suite (ADS) Lite software tool for Altera Excalibur devices
| May 2004 | 11 KB |
| PDN 0408 Altera will be discontinuing the PCI APEX Development Kits, and PCI32 Nios Target Add-On Kit
| May 2004 | 11 KB |
| PDN0405 Altera has discontinued the Nios APEX Development Kits, Nios Ethernet Kit, and Nios Linux Development Kit.
| Apr 2004 | 12 KB |
| PDN0402 Altera has discontinued the printed version of the MAX+PLUS II manual.
| Jan 2004 | 13 KB |
| PDN0401 Altera will be discontinuing several APEX 20K ordering codes
| Jan 2004 | 12 KB |
| PDN 0316 Altera will be discontinuing certain APEX 20KE device ordering codes
| Dec 2003 | 11 KB |
| PDN 0315 Altera will be discontinuing certain configuration device ordering codes
| Dec 2003 | 11 KB |
| PDN 0314 Altera will be discontinuing certain configuration, FLEX 10KA, FLEX 10KE, FLEX 6000, and FLEX 8000 device ordering codes
| Dec 2003 | 13 KB |
| PDN 0313 Quartus II Software Support for Mentor Graphics Blast Software
| Oct 2003 | 13 KB |
| PDN 0312 Altera will be discontinuing the IP MegaCore products listed in Table 1
| Sep 2003 | 17 KB |
| PDN 0311 Altera will be discontinuing the APEX DSP Development Kits Starter Version and Professional Edition products
| Aug 2003 | 79 KB |
| PDN 0307 Altera will be discontinuing the ByteBlasterMV parallel port download cable
| Jun 2003 | 6 KB |
| PDN 0303 Altera will be discontinuing some Excalibur board products
| Feb 2003 | 85 KB |
| PDN 0302 Altera will be discontinuing ordering codes: PCI-BOARD/A4E & PCI-BOARD/A4E/UNIV
| Jan 2003 | 75 KB |
| PDN 0221 Altera will be discontinuing ordering codes PCI-BOARD2/S & PCI-BOARD2/S/UNIV
| Dec 2002 | 78 KB |
| PDN 0220 FLEX 10KA Product Ordering Codes to Become Obsolete
| Dec 2002 | 85 KB |
| PDN 0218 Quartus II & MAX+PLUS II Software Operating System Support, October 30, 2002
| Oct 2002 | 64 KB |
| PDN 0204 Altera will be discontinuing certain APEX 20K, APEX 20KE, FLEX 10KE, and ACEX 1K device ordering codes
| Apr 2002 | 14 KB |
| PDN 0203 Altera will be discontinuing certain MAX 7000S, MAX 7000A, and MAX 7000B device ordering codes
| Apr 2002 | 14 KB |
| PDN 0209 Altera will be discontinuing certain QFP programming and development sockets
| Mar 2002 | 11 KB |
| PDN 0124 Altera is discontinuing all extraction tools
| Dec 2001 | 8 KB |
| PDN 0122 Altera will be discontinuing the PL-ASAP2 programming hardware and the PL-MPU and PLP6 components that comprise the PL-ASAP2 product
| Nov 2001 | 56 KB |
| PDN 0118 Altera began launching new, flexible ways to purchase MegaCore IP functions
| Nov 2001 | 100 KB |
| PDN 0117 Discontinued MAX 7000, MAX 9000, FLEX, and APEX 20K ordering codes, October 25, 2001
| Oct 2001 | 11 KB |
| PDN 0110 PCI-Board2, SOPC-Board/A6E, SOPC-Board/A10E to Become Obsolete
| Apr 2001 | 8 KB |
| PDN 0107 Selected FLEX 8000, FLEX 10K, FLEX Devices 10KA, FLEX 10KE, and APEX 20K
| Jan 2001 | 10 KB |
| PDN 0106 Selected MAX 9000 Devices
| Jan 2001 | 10 KB |
| PDN 0103 Selected MAX 7000 Devices
| Jan 2001 | 8 KB |
| PDN 0102 Selected Classic Devices
| Jan 2001 | 8 KB |
| PDN 0007 EPF10K100B To Become Obsolete
| Jun 2000 | 9 KB |
| PDN 9917 Selected Adapters to Become Obsolete
| Dec 1999 | 9 KB |
| PDN 9907 EPM7032V to become obsolete
| Jun 1999 | 13 KB |
| PDN 9817 Fourteen maintenance products are being discontinued
| Oct 1998 | 13 KB |
| PDN 9816 Six development system products are being discontinued
| Aug 1998 | 10 KB |
| PDN 9713 EPM7256SRC208-12 Update
| Sep 1997 | 3 KB |
| PDN 9710 Selected programming adapters for the EPM5016 are being obsoleted
| Aug 1997 | 3 KB |
| PDN 9709 Discontinued ordering codes and replacement products for Altera development tools
| Aug 1997 | 47 KB |
| PDN 9625 FLASHlogic EPX880 & EPX8160 to Become Obsolete
| Dec 1996 | 49 KB |
| PDN 9624 MAX 5000 Update
| Dec 1996 | 129 KB |
| PDN 9620 FLASHlogic Download Cable (PL-FLDLC)
| Sep 1996 | 84 KB |
| PDN 9618 Selected MAX 9000 Ordering Codes
| Sep 1996 | 85 KB |
| PDN 9610 In 1996, Altera will be consolidating the MAX 5000 device family which will result in selected device ordering codes being discontinued as shown in the Product Discontinuance Notice
| Apr 1996 | 8 KB |
| PDN 9603 Selected FLEX 8000 devices to be discontinued
| Feb 1996 | 90 KB |
| PDN 9601 EPX780 to be discontinued
| Jan 1996 | 96 KB |
| PDN 9517 FLEX 8000 & EPC1213 military device obsolescence schedule
| Dec 1995 | 145 KB |
| PDN 9516 Selected MAX devices to be discontinued
| Dec 1995 | 30 KB |
| PDN 9513 Military products to be discontinued
| Jun 1995 | 48 KB |
| PDN 9512 Selected FLEX 8000 devices to be discontinued
| Jun 1995 | 84 KB |
| PDN 9511 This notice is to announce Altera's intent to discontinue the EP310I device in 1996. The schedule for phase-out is noted in the Product Discontinuance Notice
| Jun 1995 | 8 KB |
| PDN 9508 Selected Classic devices to be discontinued
| Jun 1995 | 132 KB |
| PDN 9401 Phase-out of selected military devices previously acquired from Intel
| Jun 1995 | 129 KB |
| Customer Advisory |
| Title |
Release Date |
File Size |
| ADV 0804 TSMC Wafer Fabrication Sites for the Stratix III FPGA Family
| Mar 2008 | 24 KB |
| ADV 0217 Rev 1.1.0 Full Laser Marking Introduction
| Feb 2008 | 17 KB |
| ADV 0607 UFBGA 484 Package Coplanarity Enhancement
| Nov 2006 | 60 KB |
| ADV 0601 Rev01 Addition of Assembly Plant for FBGA Packages
| Mar 2006 | 21 KB |
| ADV 0505 Adding Daewon shipping tray for BGA and QFP Package Devices
| May 2005 | 20 KB |
| ADV 0501 Implementing Pb-Free Marking Codes and Indication on Labels
| Mar 2005 | 1,064 KB |
| ADV 0503 Serial Configuration Device Plating Standardization
| Mar 2005 | 16 KB |
| ADV 0502 Serial Configuration Device Plating Standardization
| Mar 2005 | 16 KB |
| ADV 0406 TQFP 32 Package Top Mold and Ejector Size Change
| May 2004 | 14 KB |
| ADV 0306 Introduction of Dual Marking on MAX 3000A Devices
| May 2003 | 55 KB |
| ADV 0305 Additional Source for Altera's PowerQuad Flat Pack Package for the FLEX 10K and APEX Device Families
| Mar 2003 | 81 KB |
| ADV 0202 Schedule for the MAX 7000AE and MAX 3000A transition to a 0.30-µm process at TSMC, Taiwan
| Feb 2002 | 13 KB |
| ADV 0201 Marking the assembly lot number and a one-line internal traceability code on all non-BGA packages
| Feb 2002 | 10 KB |
| ADV 0115 EP20K200E and EP20K300E 652-pin BGA packages will be reinforced with a stiffener
| Dec 2001 | 8 KB |
| ADV 0012 BGA Package Top Mark Enhancement
| Dec 2000 | 8 KB |
| ADV 0009 FLEX 10K Transition Schedule Update
| Sep 2000 | 9 KB |
| ADV 0003 Alternate QFP Shipping Trays
| Jan 2000 | 9 KB |
| ADV 0001 Additional Assembly Location
| Jan 2000 | 10 KB |
| ADV 9916 Top Mark Enhancement
| Nov 1999 | 10 KB |
| ADV 9914 Additional Assembly Source
| Aug 1999 | 10 KB |
| ADV 9912 FineLine BGA Packages
| Jun 1999 | 20 KB |
| ADV 9910 Test and Shipment Site Addition
| Apr 1999 | 12 KB |
| ADV 9909 EPF6016 and FLEX 10K Transition Schedule Update
| Apr 1999 | 17 KB |
| ADV 9906 Change in Tray Temperature Tolerance
| Mar 1999 | 11 KB |
| ADV 9904 Additional Source of Supply for Configuration Devices
| Jan 1999 | 20 KB |
| ADV 9814 PLCC Moisture Sensitivity Level Reclassification
| Aug 1998 | 11 KB |
| ADV 9812 EPC1064 and EPC1213 Transition Schedule Update
| Jul 1998 | 13 KB |
| ADV 9809 PL-MANUAL, PL-MANUALWS, PL-MNLVHDL, and PL-MNLVERILOG manuals to be consolidated into PL-MANUAL
| Jun 1998 | 10 KB |
| ADV 9803 EPM7032, EPM7160E, EPM9320, and EPM9560 Transition Schedule Update
| Mar 1998 | 12 KB |
| ADV 9801 FLEX 10K Moisture Rating Enhancement
| Jan 1998 | 13 KB |
| ADV 9712 FLEX 10K Additional Source of Supply
| Sep 1997 | 29 KB |
| ADV 9708 MAX 7000 & MAX 9000 0.5-micron Transition Schedule Update
| Jun 1997 | 33 KB |
| ADV 9707 Top Mark Traceability Enhancements
| May 1997 | 46 KB |
| ADV 9705 RQFP & TQFP Moisture Reclassification
| May 1997 | 59 KB |
| ADV 9701 Manufacturing Site Change
| Feb 1997 | 83 KB |
| ADV 9606 MAX 5000 Transition Schedule Update
| Feb 1997 | 39 KB |
| ADV 9623 FLEX 10K Ordering Code Change
| Dec 1996 | 117 KB |
| ADV 9622 FLEX 8000 Ordering Code Change
| Dec 1996 | 113 KB |
| ADV 9621 Classic Family Transition Schedule Update
| Nov 1996 | 91 KB |
| ADV 9617 Date Code Format
| Aug 1996 | 86 KB |
| ADV 9615 FLEX 10K Ordering Code Change
| Jun 1996 | 143 KB |
| ADV 9614 Glass Seal PGA
| Jun 1996 | 81 KB |
| ADV 9611 New Assembly Site
| Jun 1996 | 80 KB |
| ADV 9608 EP9XX and EP18XX Ordering Code Change
| Mar 1996 | 147 KB |
| ADV 9609 MAX 5000 Ordering Code Change
| Mar 1996 | 147 KB |
| ADV 9607 Process transition update for Classic devices
| Jan 1996 | 83 KB |
| ADV 9518 Ordering code changes for EP6xx devices
| Dec 1995 | 87 KB |
| ADV 9505 FLEX 8000 devices in 208-, 240-, and 304-pin RQFP packages to be shipped in dry packs
| Jun 1995 | 51 KB |
| ADV 9515 Errata for Process Change Notification 9407
| Jun 1995 | 51 KB |
| ADV 9507 Ordering code changes for Classic devices
| Jun 1995 | 100 KB |
| ADV 9506 Ordering code change for the EPM7192, EPM7160, and EPM7128 devices
| Jun 1995 | 93 KB |
| ADV 9502 Transition from a dual mark to a single mark for all products acquired from Intel
| Apr 1995 | 115 KB |
| ADV 9401 New marking procedure for 240- and 304-pin power quad flat pack (RQFP) packages
| Dec 1994 | 66 KB |
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