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Home > Products > Literature > Literature: Packaging Print This Page Subscribe to Email Literature: Packaging Packaging Title Doc Version Release Date File Size Document Part Number Data Sheets Altera Device Package Information Data Sheet 15.0 Apr 2008 4,246 KB DS-PKG-15.0 Application Notes AN 353: Reflow Soldering Guidelines for Lead-Free Packages 1.0 Jul 2004 88 KB AN-353-1.0 AN 114: Designing with High-Density BGA Packages for Altera Devices 5.1 Dec 2007 574 KB AN-114-5.1 AN 113: Plastic Package Reliability & Testing 1.0 Jun 1999 180 KB A-AN-133-01 AN 90: SameFrame Pin-Out Design for FineLine BGA Packages 1.01 Sep 2000 276 KB A-AN-090-01.01 AN 81: Reflow Soldering Guidelines for Surface-Mount Devices 4.0 Jun 2002 147 KB AN-081-04 AN 80: Selecting Sockets for Altera Devices 3.0 Jan 1999 151 KB A-AN-080-03 AN 71: Guidelines for Handling J-Lead & QFP Devices 4.0 Jan 1999 303 KB A-AN-071-04 White Papers Challenges in Manufacturing Reliable Lead Free Components 1.0 Feb 2004 387 KB WP-CHMFGRELLDFR-1.0 PDF Legal Notice Rate This Page

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