How Altera's Lead-Free Options are Used & Identified
Altera offers many products in leaded and lead-free options. Figure 1 shows where the lead (Pb) is present in the leaded devices.
Figure 1. Sources of Lead (Pb)
Altera’s lead-free option replaces the lead (Pb) with the most trusted industry-standard lead alternatives to help ease the transition to lead-free devices.
Table 1 specifies the lead-free alternative substances used for different Altera® packages as well as the backwards-compatibility of the manufacturing flow.
| Table 1. Lead-Free Materials in Altera Devices |
| Package |
Lead-Free Alternative Materials |
Backwards-Compatible Manufacturing Flow |
| QFP/TQFP |
Matte Sn |
Yes |
| BGA/FBGA |
SnAgCu (1) |
No (2) |
| SOIC |
NiPdAu |
Yes |
Notes:
- External solder ball only. Internal solder bumps in the flip-chip packages will remain unchanged.
- The lead-free alternative materials used in BGA and FineLine BGA® (FBGA) packages have a higher melting point than the leaded materials and, therefore, require a different manufacturing flow to mount the devices on a PCB board.
Identifying Altera’s Lead-Free Devices
Identification of lead-free products is one of the remaining major concerns for lead-free conversion. Altera has recognized this issue and uses the following mechanisms to identify and distinguish lead-free components from leaded components.
Ordering Codes: All lead-free components are denoted by an "N" suffix at the end of the part number. For example, "EP1C12F324C6N."
Device Marking: All lead-free components are marked with the ordering codes which contains “N” suffix.
Device Marking and Box Label: All Altera lead-free device packages with a body size of 17 x 17 mm and greater are marked with eN category codes in accordance with JEDEC standard JESD-97 (PDF). The moisture barrier bag and the shipping box are also marked with information to help identify lead-free components. Additional information including a sample label is available in ADV0501 (PDF).
Links to Additional Information
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