FPGA, CPLD, and ASIC solutions from Altera
  • Download Center
  • Literature
Sign in/register
myAltera Account
Welcome
  •   myAltera
  •   Logout
  • Products
    • Devices
    • Design Software
    • Intellectual Property
    • Development Kits/Cables
    • Design & Support Services
    • Literature
  • End Markets
    • Automotive
    • Broadcast
    • Computer & Storage
    • Consumer
    • Industrial
    • Medical
    • Military
    • Test & Measurement
    • Wireless
    • Wireline
  • Technology
    • DSP
    • External Memory
    • Embedded Processing
    • Transceivers
    • Parallel I/O
    • Signal Integrity
    • System Integration
  • Training
    • Training Courses
    • University Program
    • Webcasts & Videos
    • Demonstrations
    • Events Calendar
  • Support
    • Design & Support Resources
    • Knowledge Database
    • Devices
    • Design Software
    • Intellectual Property
    • Development Kits/Cables
    • Design Examples
    • Downloads
    • User Communities/Forums
    • mySupport
  • About Altera
    • About Us
    • Environmental
    • Customer Successes
    • Partners
    • Newsroom
    • Investor Relations
    • Jobs
    • Contact Us
  • Buy Online
    • Devices
    • Design Software
    • Development & Education Kits
    • Cables & Programming Hardware
    • Intellectual Property
  • Entire Site
  • Part Number
  • Knowledge Database
  • Support & Technical Docs
  • Forums & Wiki
Username:  
Password:  
 
Forgot my username or password
Don't have myAltera account? Register Now.
Enter your email address:

Termination Solutions in Stratix II Devices

Home > Products > Devices > Stratix II (and GX) > Stratix II > Features > Termination Solutions in Stratix II Devices

Related Links

  • AN384: Using Calibrated On-Chip Series Termination in Stratix II Devices
  • AN 336: Using External Series and Parallel Termination with Stratix and Stratix GX Devices
  • Board Design Solution Center

Signal integrity is crucial in digital design because system speeds and clock edge rates continue to increase. To improve signal integrity, both single-ended and differential signals should be properly terminated. Termination can be implemented with external termination resistors on a board, or with on-chip termination technology. Figure 1 compares the integrity of a signal without termination against one using Altera's Stratix® II device on-chip termination.

Figure 1. Stratix II Device On-Chip Termination Improves Signal Integrity

Figure 1. Stratix II On-Chip Termination Improves Signal Integrity

Stratix II devices support both on-chip termination and external termination schemes, as shown in Table 1.

Table 1. Termination Solutions Support
Termination Type On-Chip External
Series Yes Yes
Parallel Yes Yes
Differential Yes Yes

On-Chip and Off-Chip Termination Benefits

On-chip termination eliminates the need for external resistors and simplifies the design of a PCB; Stratix II device on-chip termination benefits are described in Table 2.

Table 2. Benefits of Stratix II Device On-Chip Termination
Benefit Description
Improved Signal Integrity On-chip termination eliminates stub effects and helps to prevent reflections on the transmission line.
Simpler Board Design On-chip termination minimizes the need for external resistors, allowing you to use fewer resistors, fewer board traces, and less board space, resulting in a simpler board layout.
Lower Cost With on-chip termination, fewer resistors, fewer traces, and less space are needed on the board, which means less time spent in layout. Reducing your layout time and the number of components on the board can result in lower overall system costs.
Increased System Reliability System reliability increases because on-chip termination reduces the number of components from the PCB.

Termination with external resistors, on the other hand, provides tighter tolerance and is recommended for designs with stringent impedance tolerance requirements. Altera provides an external termination design kit with recommendations for low-cost, small-form factor resistor packs, board schematics and layout examples, along with simulation and test results. Figure 2 shows how off-chip termination is implemented using resistor packs.

Figure 2. Off-Chip Termination Using Resistor Packs

Figure 2. Off-Chip Termination Using Resistor Packs

Series Termination

Stratix II devices support on-chip series termination for LVTTL, LVCMOS, SSTL-18, and SSTL-2 single-ended I/O standards (shown in Table 3). The on-chip termination is provided at the output signal to match the impedance of the transmission line, typically 25 or 50Ω. You can use this termination in many general-purpose applications and to interface with DDR SDRAM memories.

Table 3. Supported I/O Standards for Series Termination
Standard Resistance ( )
3.3-V, 2.5-V, 1.8-V, 1.5-V LVTTL 25 or 50
3.3-V, 2.5-V, 1.8-V, 1.5-V LVCMOS 25 or 50
SSTL-18, SSTL-2 (Class I) 25
SSTL-18, SSTL-2 (Class II) 25

Parallel Termination

Stratix II devices support on-chip parallel termination for SSTL and HSTL single-ended I/O standards (refer to Table 4). The on-chip parallel termination can be set to 50Ω. You can use this termination when implementing interfaces with external memories such as the DDR SDRAM and QDRII SRAM memories.

Table 4. Supported I/O Standards for Parallel Termination

Standard

Resistance ( )

SSTL-18, SSTL-2 (Class I)

50

SSTL-18, SSTL-2 (Class II)

50

1.8-V HSTL, 1.5-V HSTL (Class I)

50

1.8-V HSTL, 1.5-V HSTL (Class II)

50

1.2-V HSTL

50

Stratix II devices support parallel termination through external resistors. Altera provides an external termination design kit with recommendations for low-cost, small-form factor resistor packs, board schematics and layout examples, along with simulation and test results.

Differential Termination

You use differential termination in system applications that require support for high-speed interface protocols, such as SPI-4.2, SFI-4, XSBI, RapidIO™, HyperTransport™, NPSI, and UTOPIA IV standards.

Stratix II devices support LVDS and HyperTransport input on-chip differential termination. The value of the on-chip termination resistor, RD, shown in Figure 3 is 100Ω.

Figure 3. On-Chip Differential Termination

Figure 3. On-Chip Differential Termination

Related Links

  • Parallel I/O Technology Center
Rate This Page


  • Product Selector
    • Compare Devices (Beta)
  • High-End FPGAs
    • About Stratix Series
    • Stratix IV (E, GX, GT)
      • Overview
        • Architecture
        • Density
        • Performance
        • Power
      • Transceivers (GX and GT)
      • End Markets & Applications
      • Design Resources
      • Literature
      • Getting Started
    • Stratix III (L and E)
      • Overview
      • End Markets & Applications
      • Design Resources
      • Literature
      • Getting Started
    • Stratix II (and GX)
      • Stratix II
        • Overview
        • Design Utilities
        • Features
        • Literature
      • Stratix II GX
        • Overview
        • Design Utilities
        • Features
        • Literature
    • Stratix (and GX)
      • Stratix
        • Overview
        • Design Utilities
        • Features
        • Literature
      • Stratix GX
        • Overview
        • Design Utilities
        • Features
        • Literature
  • Midrange FPGAs
    • About Arria Series
    • Arria II GX
      • Overview
        • Architecture
        • Power
      • Transceivers
      • End Markets & Applications
      • Design Resources
      • Literature
      • Getting Started
    • Arria GX
      • Overview
        • Architecture
        • Software
      • Transceivers
      • Applications
      • Design Resources
      • Literature
      • Getting Started
  • Low-Cost FPGAs
    • About Cyclone Series
    • Cyclone IV (E and GX)
      • Overview
        • Architecture
        • Power
      • Transceivers
      • End Markets & Applications
      • Design Resources
      • Literature
      • Getting Started
    • Cyclone III (and LS)
      • Overview
        • Architecture
        • Power
        • Security
      • End Markets & Applications
      • Design Resources
      • Literature
      • Getting Started
    • Cyclone II
      • Overview
      • Design Utilities
      • Features
      • Literature
    • Cyclone
      • Overview
      • Design Utilities
      • Features
      • Literature
  • CPLDs
    • About MAX Series
    • MAX II (and G, Z)
      • Overview
        • Architecture
        • Power
        • Unique Features
      • Applications
      • Design Resources
      • Literature
      • Getting Started
    • MAX 3000A
      • Overview
      • Design Utilities
      • Features
      • Literature
  • ASICs
    • About HardCopy Series
    • HardCopy IV (E and GX)
      • Overview
        • Power
        • SEU
        • Performance
      • Transceivers
      • End Markets & Applications
      • Literature
      • Getting Started
    • HardCopy III
      • Overview
        • Architecture
        • Power
        • SEU
        • Performance
      • End Markets & Applications
      • Literature
      • Getting Started
    • HardCopy II
      • Overview
        • Power
        • SEU
        • Performance
      • End Markets & Applications
      • Literature
      • Getting Started
  • Device-Specific Offerings
    • RoHS Compliant
      • Packaging Literature
    • Extended Temperature
    • Enhanced Temperature
    • Military Temperature
  • Configuration Devices
    • Enhanced Configuration
      • Overview
      • Design Utilities
      • Features
      • Literature
    • Serial Configuration
      • Overview
      • Design Utilities
      • Features
      • Literature
  • Mature Products
    • Product Listing
    Please give us feedback
    Products | End Markets | Technology | Training | Support | About Altera | Buy Online
    Jobs | Investor Relations | Contact Us | Site Map | Privacy | Legal Notice
    Copyright © 1995-2010 Altera Corporation. All Rights Reserved.
    Altera Forum
    Altera
    Forum
    Twitter
    Twitter
    RSS
    RSS
    Facebook
    Facebook
    Flickr
    Flickr
    YouTube
    YouTube
    Email Updates
    Email
    Updates