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Differences between Stratix II & Stratix Devices

Home > Products > Devices > Stratix II (and GX) > Stratix II > Design Utilities > Differences between Stratix II & Stratix Devices

Stratix® II FPGAs are based on the same industry-preferred feature set as the award-winning first-generation Stratix devices with the addition of many key enhancements. Stratix II devices offer several new features such as the new and innovative adaptive logic modules (ALMs), 1-Gbps source-synchronous signaling with dynamic phase alignment (DPA), and design security, among others.

Innovative Logic Structure

Stratix II devices have an innovative, highly-efficient logic structure that offers higher performance and higher density. With up to 180K equivalent LEs, Stratix II devices offer more than twice the capacity of first-generation Stratix devices.

The Stratix II device's ALMs delivers more logic capacity and faster performance in a smaller physical area. Because it permits inputs to be shared by adjacent look-up tables (LUTs), the new structure significantly reduces the total number of equivalent logic elements (LEs) required to implement any given function, and more importantly, reduces the number of logic levels in a given critical path. Multiple, independent functions can also be packed into a single ALM, further reducing logic resource requirements. This is important at the 90-nm node where interconnect delay assumes the larger proportion of the total FPGA delay and where reducing interconnect traversals is crucial to maximizing device performance. The ALM also offers the ternary adder function that reduces logic resource consumption for long adder trees.

In addition to increased resource usage efficiency, ALMs delivers an average of 50 percent faster core performance, and over twice the logic capacity, of prior-generation FPGAs. Support for internal clock frequency rates of up to 500 MHz and typical design performance at over 250 MHz means that designers can now get ASIC-like performance with the time-saving advantages of implementing their designs with programmable logic.

Design Security

To provide designers with a means to protect their systems, Stratix II devices support configuration bitstream encryption using the advanced encryption standard (AES) and a 128-bit non-volatile key. Each Stratix II device can be securely configured with an encrypted configuration file generated by Quartus® II software and stored in an external configuration device. The Design Security web page has more information.

Source-Synchronous Signaling With Dynamic Phase Alignment

Stratix II devices give designers access to 152 receiver and 156 transmitter high-speed differential I/O channels capable of 1.040-Gbps performance. Each of these I/O channels includes dedicated serializer/deserializer (SERDES) and dynamic phase alignment (DPA) circuitry for reliable data transfer, simplifying the complexity associated with implementing high-speed interface standards such as 10-Gbit Ethernet XSBI, SFI-4, SPI-4.2, HyperTransport™ technology, the RapidIO™ standard, and CSIX. The Stratix II Source-Synchronous Protocols page has more details.

Feature Comparison

The Stratix II architecture builds on the highly successful Stratix architecture and offers the same features as Stratix devices including the innovative TriMatrix™ memory structure, speed-optimized digital signal processing (DSP) blocks, and advanced clock-management circuitry Table 1 summarizes the features offered by Stratix and Stratix II devices.

Table 1. Stratix II & Stratix Feature Comparison
Features Device
Stratix II Stratix
Process Technology
  • 90 nm
  • 0.13 µm
Logic Density
  • Up to 179,400 equivalent LEs
  • Up to 79,040 LEs
Core Voltage
  • 1.2 Volts
  • 1.5 Volts
LE Structure
  • Adaptive Logic Module (ALM) structure that can implement any 6-input function and some 7-input functions
  • 4-input LUT-based structure
TriMatrix Memory
  • Up to 9 Mbits of memory
  • Up to 7 Mbits of memory
External Memory Interface Support
  • DDR2, RLDRAM II, QDR II, DDR, QDR, SDR
  • DDR2, RLDRAM II, QDR II, DDR, QDR, FCRAM, ZBT,SDR
Embedded Multipliers
  • Up to 96 DSP Blocks
  • Up to 384 18x18 Multipliers
  • Up to 22 DSP Blocks
  • Up to 88 18x18 Multipliers
Enhanced & Fast PLLs (1)
  • Up to 4 enhanced and 8 fast PLLs
  • Up to 4 enhanced and 8 fast PLLs
Clock Networks
  • Up to 48 global clock networks
  • 40-48 clock networks
Differential I/O Support
  • Up to 1.040 Gbps data rates for LVDS, LVPECL and HyperTransport standards
  • Up to 840 Mbps data rates for LVDS, LVPECL and HyperTransport standards
Source-Synchronous Signaling
  • LVDS, HyperTransport
  • LVDS, HyperTransport, LVPECL, PCML
Source-Synchronous Protocol Support
  • SPI-4.2, SFI-4, XSBI, HyperTransport, RapidIO, NPSI, and UTOPIA IV standards
  • SPI-4.2, SFI-4, XSBI, HyperTransport, RapidIO, NPSI, and UTOPIA IV standards
DPA
  • Yes
  • No
Single-Ended I/O Support
  • SSTL, HSTL, PCI, and PCI-X
  • SSTL, HSTL, PCI, and PCI-X
Design Security
  • Yes
  • No
Nios Embedded Processor Support
  • Yes
  • Yes
HardCopy™ Device Support
  • Yes
  • Yes

Note to Table 1:

  1. PLLs = Phase-locked loops

Table 2 summarizes how Stratix devices compare with Stratix II devices in terms of available logic resources.

Table 2. Stratix & Stratix II Device Comparison
Stratix Devices Stratix II Devices
Device LEs Total Memory
Bits
PLLs 18x18 Multipliers Device Equivalent LEs Total Memory Bits PLLs 18x18 Multipliers
EP1S10 10,570 920,448 6 24          
          EP2S15 15,600 419,328 6 48
EP1S20 18,460 1,669,248 6 40          
EP1S25 25,660 1,944,576 6 40          
EP1S30 32,470 3,317,184 10 48 EP2S30 33,880 1,369,728 6 64
                   
EP1S40 41,250 3,423,744 12 56          
EP1S60 57,120 5,215,104 12 72 EP2S60 60,440 2,544,192 12 144
EP1S80 79,040 7,427,520 12 88          
          EP2S90 90,960 4,520,448 12 192
          EP2S130 132,540 6,747,840 12 252
          EP2S180 179,400 9,383,040 12 384

Related Links

  • Stratix II Devices
  • Stratix Devices
  • Stratix II Device Family Features
  • Stratix Device Family Features
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