Stratix III FPGA Device Family Overview
The Stratix® III family of high-end FPGAs includes the following two device variants:
- Stratix III L devices focused on logic-rich applications
- Stratix III E devices focused on digital signal processing (DSP)-rich and memory-rich applications
Stratix III FPGAs provide vertical migration, not only within, but across the L and E variants to offer the most flexibility in device selection.
Industry Leading Architecture
Altera has taken the industry leading architecture of the Stratix high-performance FPGA series and refined it even further for a 65-nm process node. As a result, Stratix III FPGAs are the ideal solution for your next-generation high-end system designs.
Key feature enhancements Stratix III FPGAs offer include:
- The lowest power requirements of any high-performance FPGA—up to 50 percent lower than Stratix II devices, without adding the reliability risk of heatsinks or forced-air cooling
- Higher performance to power next-generation systems—up to a 35 percent gain over Stratix II high-performance FPGAs
- Increased density that lets you integrate more of your product to reduce cost and reduce board space—up to twice the density of Stratix II FPGAs
- Development supported by Quartus® II software—customer-acclaimed as the leading development software in productivity for low-power, high-density, high-performance FPGAs
- High-performance memory interfaces up to 533-MHz DDR3
- LVDS performance up to 1.6 Gbps and support for Serial Gigabit Media Independent Interface (SGMII) on the LVDS I/Os
| Table 1. Stratix III Logic-Rich Device Overview |
| Stratix III L Family Variants |
| Device |
EP3SL50 |
EP3SL70 |
EP3SL110 |
EP3SL150 |
EP3SL200 |
EP3SE260 (1) |
EP3SL340 |
| Adaptive Logic Modules (ALMs) |
19,000 |
27,000 |
42,600 |
56,800 |
79,560 |
101,760 |
135,200 |
| Equivalent Logic Elements (LEs) |
47,500 |
67,500 |
106,500 |
142,000 |
198,900 |
254,400 |
338,000 |
| Registers |
38,000 |
54,000 |
85,200 |
113,600 |
159,120 |
203,520 |
270,400 |
| M9K Memory Blocks |
108 |
150 |
275 |
355 |
468 |
864 |
1,040 |
| M144K Memory Blocks |
6 |
6 |
12 |
16 |
24 |
48 |
48 |
| Embedded Memory (Kbits) |
1,836 |
2,214 |
4,203 |
5,499 |
7,668 |
14,688 |
16,272 |
| MLAB (Kbits) |
594 |
844 |
1,331 |
1,775 |
2,486 |
3,180 |
4,225 |
| 18 x 18 Multipliers (2) |
216 |
288 |
288 |
384 |
576 |
768 |
576 |
Availability
(Commercial Grade) |
Q2 2008
|
Available
|
Q2 2008 |
Available
Buy Now |
Q2 2008 |
Available
|
Available
Buy Now |
| User I/O |
| Package (3) |
EP3SL50 |
EP3SL70 |
EP3SL110 |
EP3SL150 |
EP3SL200 |
EP3SE260 |
EP3SL340 |
| F484 |
288 |
288 |
|
|
|
|
|
| F780 |
480 |
480 |
480 |
480 |
480 (4) |
480 (4) |
|
| F1152 |
|
|
736 |
736 |
736 |
736 |
736 (4) |
| F1517 |
|
|
|
|
864 |
960 |
960 |
| F1760 |
|
|
|
|
|
|
1,104 |
| Table 2. Stratix III Enhanced Device Overview |
| Stratix III E Family Variants |
| Device |
EP3SE50 |
EP3SE80 |
EP3SE110 |
EP3SE260 |
| Adaptive Logic Modules (ALMs) |
19,000 |
32,000 |
42,600 |
101,760 |
| Equivalent Logic Elements (LEs) |
47,500 |
80,000 |
106,500 |
254,400 |
| Registers |
38,000 |
64,000 |
85,200 |
203,520 |
| M9K Memory Blocks |
400 |
495 |
639 |
864 |
| M144K Memory Blocks |
12 |
12 |
16 |
48 |
| Embedded Memory (Kbits) |
5,328 |
6,183 |
8,055 |
14,688 |
| MLAB (Kbits) |
594 |
1,000 |
1,331 |
3,180 |
| 18 x 18 Multipliers (2) |
384 |
672 |
896 |
768 |
Availability
(Commercial Grade) |
Available
|
Q2 2008 |
Available
|
Available
|
| User I/O |
| Package (3) |
EP3SE50 |
EP3SE80 |
EP3SE110 |
EP3SE260 |
| F484 |
288 |
|
|
|
| F780 |
480 |
480 |
480 |
480 (4) |
| F1152 |
|
736 |
736 |
736 |
| F1517 |
|
|
|
960 |
Notes to Tables 1 and 2:
- The EP3SE260 device (a Stratix III E family variant) provides optimum logic, DSP, and memory for this device density.
- For full details on DSP resources for all families see the Stratix III Digital Signal Processing web page.
- For full package details, see the Altera® Device Package Information (PDF).
- The EP3SE260 and EP3SL200 devices use an H780 package, and the EP3SL340 is in an H1152 package to maintain vertical package migration. These packages require a keep-out area to be created to allow for the overhang of the H package.
| Table 3. Package Vertical Migration (1) |
| Stratix III variant |
Device |
F484 |
F780 |
F1152 |
F1517 |
F1760 |
Stratix III L
(Logic) |
EP3SL50 |
288 (2) |
480 |
|
|
|
| EP3SL70 |
288 |
480 |
|
|
|
| EP3SL110 |
|
480 |
736 |
|
|
| EP3SL150 |
|
480 |
736 |
|
|
| EP3SL200 |
|
480 (3) |
736 |
864 |
|
| EP3SL340 |
|
|
736 (3) |
960 |
1,104 |
Stratix III E
(Enhanced) |
EP3SE50 |
288 |
480 |
|
|
|
| EP3SE80 |
|
480 |
736 |
|
|
| EP3SE110 |
|
480 |
736 |
|
|
| EP3SE260 |
|
480 (3) |
736 |
960 |
|
Notes to Table 3:
- All device densities that are available in the same package are vertically migratable (i.e. they share the same VCC, GND, in-system programmables, and dedicated input pins).
- Number of available User I/O pins.
- The EP3SE260 and EP3SL200 devices use an H780 package, and the EP3SL340 is in a H1152 package to maintain vertical package migration. These packages require a keep-out area to be created to allow for the overhang of the H package.
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