|
|
 |
Device Packaging Specifications

Choose a package and pin count from the list below to view the packaging specifications. This information is also available in the Device Packaging Data Sheet (PDF).
| Table 1. Altera Device Packaging Specifications |
Package
Acronym |
Package Name |
Altera
Code |
Pin Count
(PDF) |
Package
Interconnection |
File Size |
| BGA |
Ball Grid Array |
B |
256 Option 1 |
Wirebond |
94 KB |
| 256 Option 2 |
Wirebond |
115 KB |
| 356 |
Wirebond |
94 KB |
| 600 |
Wirebond |
99 KB |
| 652 Option 1 |
Flip Chip |
104 KB |
| 652 Option 2 |
Wirebond |
103 KB |
| 652 Option 3 |
Wirebond |
101 KB |
| 672 |
Wirebond |
103 KB |
| 724 |
Flip Chip |
114 KB |
| 956 |
Flip Chip |
113 KB |
| CerDIP |
Ceramic Dual-in-Line Package |
D |
24 |
Wirebond |
88 KB |
| 40 |
Wirebond |
90 KB |
| FBGA |
FineLine BGA |
F |
100 Option 1 |
Wirebond |
93 KB |
| 100 Option 2 |
Wirebond |
95 KB |
| 144 |
Wirebond |
95 KB |
| 256 Option 1 |
Wirebond |
100 KB |
| 256 Option 2 |
Wirebond |
99 KB |
| 324 |
Wirebond |
99 KB |
| 400 |
Wirebond |
123 KB |
| 484 Option 1 |
Flip Chip |
103 KB |
| 484 Option 2 |
Wirebond |
113 KB |
| 484 Option 3 |
Wirebond |
104 KB |
| 672 Option 1 |
Flip Chip |
116 KB |
| 672 Option 2 |
Wirebond |
118 KB |
| 672 Option 3 |
Wirebond |
106 KB |
| 780 |
Flip Chip |
116 KB |
| 780 Option 2 |
Wirebond |
97 KB |
| 896 |
Wirebond |
107 KB |
| 1,020 |
Flip Chip |
126 KB |
| 1,152 |
Flip Chip |
150 KB |
| 1,508 |
Flip Chip |
154 KB |
| 1,517 |
Flip Chip |
214 KB |
| 1,760 |
Flip Chip |
132 KB |
| MBGA |
Micro FineLine BGA
|
M
|
68
|
Wirebond
|
67 KB
|
|
100
|
Wirebond
|
93 KB
|
|
144
|
Wirebond
|
78 KB
|
| 164 |
Wirebond
|
72 KB |
|
256
|
Wirebond
|
215 KB
|
| PGA |
Pin Grid Array |
G |
68 |
Wirebond |
68 KB |
| 160 |
Wirebond |
92 KB |
| 192 |
Wirebond |
100 KB |
| 232 |
Wirebond |
97 KB |
| 280 |
Wirebond |
101 KB |
| 403 |
Wirebond |
110 KB |
| 503 |
Wirebond |
129 KB |
| 599 |
Wirebond |
122 KB |
| 655 |
Wirebond |
125 KB |
| HBGA |
Hybrid FineLine BGA |
H |
484 |
Flip Chip |
111 KB |
|
780
|
Flip Chip
|
665 KB
|
|
1152
|
Flip Chip
|
182 KB
|
| PLCC |
Plastic J-Lead Chip Carrier |
L |
20 |
Wirebond |
89 KB |
| 28 |
Wirebond |
87 KB |
| 44 |
Wirebond |
88 KB |
| 68 |
Wirebond |
89 KB |
| 84 |
Wirebond |
92 KB |
| PDIP |
Plastic Dual-in-Line Package |
P |
8 |
Wirebond |
112 KB |
| 24 |
Wirebond |
88 KB |
| 40 |
Wirebond |
88 KB |
| EQFP |
Plastic Enhanced Quad Flat Pack |
E |
144 |
Wirebond |
77 KB |
| PQFP |
Plastic Quad Flat Pack |
Q |
44 |
Wirebond |
94 KB |
| 160 |
Wirebond |
97 KB |
| 208 |
Wirebond |
95 KB |
| 240 |
Wirebond |
101 KB |
| RQFP |
Power Quad Flat Pack |
R |
208 |
Wirebond |
100 KB |
| 240 |
Wirebond |
101 KB |
| 304 |
Wirebond |
106 KB |
| SOIC |
Small Outline Integrated Circuit |
S |
8 |
Wirebond |
95 KB |
| 16 |
Wirebond |
107 KB |
| 24 |
Wirebond |
91 KB |
| TQFP |
Thin Quad Flat Pack |
T |
32 |
Wirebond |
95 KB |
| 44 |
Wirebond |
95 KB |
| 100 |
Wirebond |
98 KB |
| 144 |
Wirebond |
99 KB |
| UBGA |
Ultra FineLine BGA |
U |
49 |
Wirebond |
109 KB |
| 88 |
Wirebond |
91 KB |
| 169 |
Wirebond |
111 KB |
| 256 |
Wirebond |
84 KB |
| 484 |
Wirebond |
104 KB |
|
 |
|
|
|