Altera Home Page
Literature Licensing
Buy On-Line Download

  Home   |   Products   |   Support   |   End Markets   |   Technology Center   |   Education & Events   |   Corporate   |   Buy On-Line  
  Knowledge Database   |   Devices   |   Design Software   |   Intellectual Property   |   Design Examples   |   mySupport   |   Reference Designs  

 CPLDs
      MAX II
      MAX 3000A
      MAX 7000
  
 FPGAs
      Cyclone III
      Cyclone II
      Cyclone
      Stratix III
      Stratix II/Stratix II GX
      Stratix/Stratix GX
      Arria GX
  
 Structured ASICs
      HardCopy II
      HardCopy Stratix
      HardCopy APEX 20K
  
 Downloads
      Device Pin-Outs
      Gerber Files
      IBIS Models
   BSDL/BST
      PCB Symbols
  
 Configuration/Programming
   Configuration
   Programming
   Programming Tools
  
 Power
   Power Management
      Early Power Estimators
      Certified Power Solutions
  
 I/O
      I/O Specifications
      Hot Socketing
  
 PLL & Clock Management
      Overview
      PLL Basics
      Using PLLs in Software
      Jitter Information
      Clock Networks
      Glossary
  
 Packaging & Board Design
      Specification
      Thermal Resistance
      Sockets and Layout
      Manufacturing
  
 Quality & Reliability
      MSL Calculator
      Certifications
   Environmental
      PCNs & Advisories
   Reports
      Single Event Upset
  
 Failure Analysis
      Overview
      Capabilities
  

Thermal Resistance

View the ThetaJA (junction-to-ambient thermal resistance) and ThetaJC (junction-to-case thermal resistance) values for the following Altera® devices:

Thermal resistance values for all Altera device families can be found in their respective device handbooks (see the literature section) or the Altera Device Package Information Data Sheet (PDF).

Altera is transitioning to an industry-standard copper lid for its thermally enhanced ball grid array (BGA) and thermally enhanced flip-chip FineLine BGA® (FBGA) packages. For details, see Process Change Notice PCN024 (PDF). This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur device families in that these families now  have two thermal resistance specifications: the aluminum silicon carbide (AlSiC) lid for older packages, and the copper (Cu) lid for newer packages.

Thermally enhanced BGA and thermally enhanced flip-chip FBGA packages in newer Altera families—including Stratix and Stratix GX—were introduced using an industry-standard Cu lid. Therefore, these device specifications include only a single thermal resistance specification.


Ease Your RoHS Transition with Altera

  Please Give Us Feedback