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Home > Support > Devices > Thermal Resistance Print This Page Subscribe to Email Thermal Resistance View the JA (junction-to-ambient thermal resistance) and JC (junction-to-case thermal resistance) values for the following Altera® devices: Stratix® series devices (PDF) Cyclone® series devices (PDF) MAX® series devices (PDF) HardCopy® series devices (PDF) APEX™ series devices (PDF) ACEX™ 1K devices (PDF) Mercury™ devices (PDF) FLEX® series devices (PDF) Excalibur™ devices (PDF) Classic™ devices (PDF) Thermal resistance values for all Altera device families can be found in their respective device handbooks (see the literature section) or the Altera Device Package Information Data Sheet (PDF). Altera is transitioning to an industry-standard copper lid for its thermally enhanced ball grid array (BGA) and thermally enhanced flip-chip FineLine BGA® (FBGA) packages. For details, see Process Change Notice PCN024 (PDF). This change affects the APEX 20KE, APEX 20KC, APEX II, Mercury, and Excalibur device families in that these families now  have two thermal resistance specifications: the aluminum silicon carbide (AlSiC) lid for older packages, and the copper (Cu) lid for newer packages. Thermally enhanced BGA and thermally enhanced flip-chip FBGA packages in newer Altera families—including Stratix and Stratix GX—were introduced using an industry-standard Cu lid. Therefore, these device specifications include only a single thermal resistance specification. Rate This Page

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