Altera’s product and technology families at 14 nm and 20 nm focus on mixed-system fabrics that enable silicon convergence of capabilities in customer systems. Through a combination of high-density monolithic design and the enablement of 3D silicon technology, Altera’s evolved mixed-system fabric offers an entirely new class of system and architecture design tools though high-performance capabilities in transceiver technology, digital signal processing (DSP), general-purpose processing, and custom logic.
Next-Generation Transceiver Technology
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Altera’s next-generation 20 nm product families will feature leading-edge transceiver technology. Altera has successfully demonstrated 32 Gbps transceiver performance on 20 nm silicon developed on TSMC’s 20SoC process technology. This technology enables customers to design high-bandwidth communication links used in a wide range of designs in wireline, wireless, military, and broadcast applications including 100G and 400G data transmission, networking, remote radio heads, and servers. 20 nm transceivers feature the lowest power consumption, fastest timing closure, and superior signal integrity needed for the most demanding applications. |
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Related Video: Next Generation Transceiver Technology at 20 nm |
Next-Generation Silicon Interface Technology
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Altera’s next-generation product families will introduce advanced 3D die-stacking technology to enable new classes of applications and new levels of systems integration. This technology will feature a highly customer-accessible mixed-system digital interface standard enabling low latency and low power-enabling FPGA integration with memory extensions (SRAM, DRAM), optical transceiver modules, and user-optimized HardCopy® ASICs. The applications of this 3D integration technology will be fueled by the innovations and creativity of the worldwide Altera user community. |
Next-Generation High-Performance Design
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DSP developers will no longer need to spend days and weeks trading productivity for performance when evaluating FPGA DSP solutions. Through integration of OpenCLTM and DSP innovations, Altera products will be able to achieve over 5 teraFLOPs of single-precision (IEEE 754) DSP power utilizing industry-standard design tools and software libraries, and will reset industry benchmarks in TFLOPs/watt silicon efficiency. Applications of this very-high-performance DSP capability in mixed-system fabric include high-performance and low-latency financial calculations, high-resolution broadcast and wireless, and advanced military sensors and battle-field awareness. |
