Customer Notifications

Notification

Date Issued

Type Description
PCN-2013-022013-04-30Site ExpansionEnpirion is expanding its manufacturing capacity to add a second source.
PCN-2013-012013-03-20Data Sheet UpdateProduct Data Sheet for EN2340QI has been updated from Rev C to Rev D to provide a better and more accurate description for the device functional characteristics. Customers are recommended to download newest version.
PCN-2011-022011-09-12Material ChangeEnpirion is converting to copper wire as a qualified wire bond material for device packaging: EN5310DC, EN5310DI, EN5330DC, EN5330DI
PCN-2011-012011-09-12Material ChangeEnpirion is converting to copper wire as a qualified wire bond material for QFN devices: EN5335QI, EN5336QI, EN5365QI, EN5366QI, EN5364QI, EN5394QI
EN5395QI, EN5396QI, EA100BCM, EA108BCM, EN104INT, EN110INT.
PCN-2010-02r012011-01-05Material ChangeEnpirion is converting to copper wire as a qualified wire bond material for QFN devices: EN5337QI, EN5327QI, EA101BCM, EN109INT, EX3AV.
PCN-2010-01 r012010-06-28Material & Site ChangeEnpirion has qualified copper bond material for QFN devices at HANA Semiconductor, Thailand: EN5322QI, EA102BCM, EN103INT, EN106AMN.
PCN-2010-022010-04-12Material ChangeEnpirion is converting to copper wire as a qualified wire bond material for QFN devices: EN5337QI, EN5327QI, EA101BCM, EN109INT, EX3AV.
PCN-2010-01 r002010-04-12Material & Site ChangeEnpirion is converting to copper wire as a qualified wire bond materialfro QFN devices. The device assembly will be done at HANA Semiconductor, Thailand: EN5322QI, EA102BCM, EN103INT, EN106AMN.
PDN-2009-012009-02-16Product DiscontinuationEN5360DC, EN5360DI - This product has become obsolete and replaced by newer products.