RoHS Compliant, Environmentally Friendly FPGAs, SoCs, and CPLDs

Intel offers device packages that are fully compliant with the restriction of hazardous substances (RoHS) directive adopted by the European Union. This directive controls the content of hazardous substances in electronic equipment, and it took effect on July 1, 2006. The RoHS Directive has been updated by the European Union and it is now RoHS II (No. 2011/65/EU). RoHS II came into force on 3rd of January 2013. Intel's RoHS compliance devices are also in compliance with RoHS II. RoHS-compliant devices include Stratix®series FPGAs, Arria®series FPGAs, Cyclone® series FPGAs, APEX™, ACEX®, FLEX®, and Mercury™ devices, MAX® series CPLDs as well as configuration devices.

Download Intel's RoHS-compliant customer letter

You can obtain the ROHS II declaration of conformity by entering the ordering part number below.

Enter Part Number:
(e.g. EP3C5M164C8N)
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Product Leadership

Intel is a preeminent developer of RoHS-compliant programmable logic solutions and has been shipping environmentally friendly production devices since 2002. These devices range from Intel's 8-pin small-outline integrated circuit (SOIC) packages to large flip-chip FineLine BGA packages. Today, Intel maintains one of the most extensive RoHS-compliant product offerings in the industry. The RoHS II Directive continues to retain exemption 15 (Pb in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages) without a specified expiration date. Assuming no renewal, by default this exemption will expire in 2016. In anticipation of this expiration, Intel has been evaluating material for Pb-free flip-chip packages since 2008. Intel expects to fully qualify medium-size die (≤ 400 mm²) in flip-chip packages in Q2 2014. Intel, along with many other semiconductor vendors, have petitioned for extension of exemption 15 for specific die size or process geometry criteria. Intel has fully qualified die sizes within the petition boundary criteria for Pb-free flip chip packaging compliant to RoHS II Directive without need for exemption 15. Selected part numbers from products in this criteria are available and shipping. Intel ships newer product families (20 nm and beyond) in full RoHS II compliant Pb-free flip-chip packages. RoHS-compliant flip-chip devices with no exemptions are denoted by suffix “G”. Wire-bonded packages with suffix “N” are already RoHS-compliant without exemptions.

Product Category Qualification Status Availability and Ordering Information

All Cyclone
All FLEX
All MAX
All Configuration Products
PowerSoC

Cu-Pillar (Cyclone V)
WireBond (All other products)

Devices with an “N” suffix in the ordering code are RoHS6 compliant without Exemption 15

Available now. Contact your local Intel Sales representative for details

Arria II, Arria V GX, Arria V GT, Stratix III, Stratix IV

FlipChip; small/medium densities

Complete

Contact your local Intel Sales representative for specific part number availability[2]

Stratix III, Stratix IV

FlipChip; large densities

Conversion not planned [1]

Stratix V

FlipChip; all densities

Conversion not planned [1]

Intel® Arria 10

FlipChip; all members

Complete

Available now. Contact your local Intel Sales representative for details

Intel Stratix 10

FlipChip; all members

Complete

Contact your local Intel Sales representative for details

Stratix I, Stratix II, APEX, Mercury, Excalibur™

FlipChip; legacy (90 nm and older process nodes)

Conversion not planned [1]

HardCopy®

Conversion not planned

Intel Enpirion PowerSoC All devices are RoHS compliant
Notes:
  1. The qualification of this category of products is governed by the final decision of the European Union (EU) to extend the expiration of Exemption 15. Intel will publish updated plans as information becomes available on the decision from the EU.
  2. RoHS-compliant flip-chip devices with no exemptions are denoted by the suffix “G.”
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RoHS-Compliant Packaging

Intel's RoHS-compliant devices comply with the maximum concentration restrictions, as required in the EU Directive on the Restriction of Hazardous Substances (“RoHS Directive”) No. 2011/65/EU, with respect to lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), and polybrominated diphenyl ethers (PBDE).

All other Intel devices, except ceramic packages, comply with the RoHS Directive No. 2011/65/EU, with respect to all substance concentration restrictions except lead (Pb). The lead contained in these devices is for soldering purposes, including ceramic packages that contain lead in the solder glass seal.

Joint Industry Guide (JIG) Level A and RoHS chemical content details are available by the package type.

In response to China's promulgation of the "Management Methods for Controlling Pollution Caused by Electronic Information Products Regulation," also known as China RoHS, Intel is also providing information on controlled substances contained in our products. See the Chinese RoHS page for details.

Altera's RoHS-Compliant Product Offerings

Intel's RoHS-compliant solutions are available for the following devices:

  • Stratix series FPGAs
  • Arria series FPGAs
  • Cyclone series FPGAs
  • MAX and MAX II CPLDs
  • Configuration devices
  • Enpirion PowerSoC devices

These devices include the entire range of Intel device packages—from the 8-pin small-outline integrated circuit (SOIC) to the 1,932-ball flip-chip FineLine BGA package.

While Intel's products have a significantly longer life cycle compared to other semiconductor devices, there are some mature products now slated for end of life that Intel will not be offering in RoHS-compliant options. For details about ordering RoHS-compliant devices, or special terms regarding devices not yet available in the RoHS-compliant option, contact your local Intel sales office.

Life Expectancy of Leaded Devices

Intel does not have any immediate plan to obsolete any leaded products with the introduction of RoHS-compliant devices. However, all devices are subject to yearly review based on usage and manufacturability.

Intel offers many products in leaded and RoHS-compliant options. Figure 1 shows where the lead (Pb) is present in the leaded devices.

Figure 1. Sources of Lead (Pb)

Intel’s RoHS-compliant option replaces the lead (Pb) with the most trusted industry-standard lead alternatives to help ease the transition to RoHS-compliant devices.

Table 1 specifies the RoHS-compliant alternative substances used for different Intel packages as well as the backwards-compatibility of the manufacturing flow.

Table 1. RoHS-Compliant Materials in Intel FPGA Devices

Package RoHS-Compliant Alternative Materials Backwards-Compatible Manufacturing Flow
QFP/TQFP Matte Sn Yes
BGA/FBGA SnAgCu No
SOIC NiPdAu Yes

Notes:

  1. External solder ball only. Internal solder bumps in the flip-chip packages will remain unchanged.
  2. The RoHS-compliant alternative materials used in BGA and FineLine BGA (FBGA) packages have a higher melting point than the leaded materials and, therefore, require a different manufacturing flow to mount the devices on a PCB board.
 

Identifying Intel's RoHS-Compliant FPGA Devices

Identification of RoHS-compliant products is one of the remaining major concerns for RoHS-compliant conversion. Intel recognizes this issue and uses the following mechanisms to identify and distinguish RoHS-compliant components from leaded components.

Ordering Codes: All RoHS-compliant components are denoted by an "N" suffix at the end of the part number. For example, "EP1C12F324C6N."

Device Marking: All RoHS-compliant components are marked with the ordering codes that contain the “N” suffix.

Device Marking and Box Label: All Intel RoHS-compliant device packages with a body size of 17 x 17 mm and greater are marked with eN category codes in accordance with JEDEC standard JESD-97 (PDF). The moisture barrier bag and the shipping box are also marked with information to help identify RoHS-compliant components. Additional information including a sample label is available in ADV0501 (PDF).

 

Table 2. RoHS-Compliant Materials in Intel Enpirion PowerSoC Devices

Package RoHS-Compliant Alternative Materials Backwards-Compatible Manufacturing Flow
QFN Matte Sn Yes
QFN (EQC1241) NiPdAu Yes
QFN (EM21X0) Au Yes

Notes:  All Enpirion devices are designed for lead-free capability, with lead-free external solderable finish. No special ordering codes, suffix are required for lead-free product ordering. 

 

RoHS-Compliant Product Information

Nations around the world are passing strong legislation to restrict the use of hazardous substances in electronics. In Japan, the Ministry of International Trade has legislation to phase out the use of lead in electronics. In Europe, the European Union (EU) has the Wastes in Electrical and Electronic Equipment (WEEE) directive that includes a ban on lead-bearing solders scheduled to take effect in July 2006.

Intel is taking an industry leadership position and adopting technologies compliant with the restriction of hazardous substances (RoHS) directive to provide solutions that align with the industry requirements. In semiconductors, lead is mainly used in packaging as a part of the eutectic solder used as the surface finish for leaded packages and as the solder balls for ball-grid array (BGA) packages. Intel engineers have researched alternatives for lead compounds as well as the reliability concerns for these options, and have successfully qualified numerous RoHS-compliant packages.RoHS-Compliant Alloy Compositions.

Table 1. RoHS-Compliant Alternatives

  SN (1) SnAgCu (2) NiPdAu (3) Au (4)
QFP (5) Yes      
FBGA (6)   Yes    
SOIC (7)     Yes  
QFN (8) Yes   Yes Yes
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Notes:

  1. Tin
  2. Tin-Silver-Copper
  3. Nickel-Palladium-Gold
  4. Gold
  5. TQFP/PQFP/PLCC packages
  6. FBGA: FineLine BGA packages
  7. SOIC: Small Outline Integrated Circuit
  8. Quad Flat No-Leads

 

For QFP packages, matte tin has been chosen as the RoHS-compliant alternative. This surface finish has been in high-volume use in the electronics industry for a number of years and its plating characteristics and reliability performance have been thoroughly tested. Matte tin offers excellent solderability and wetting with existing tin-lead solder processes and with lead-free soldering processes. Pure matte tin is a good choice from a manufacturing perspective because it is a single-metal alloy and has better manufacturability than plating of a multi-element alloy with a fixed composition.

For BGA packages, the eutectic solder balls have been replaced by Sn3%Ag0.5%Cu solder balls as the RoHS-compliant alternative. The microstructure of the SnCuAg alloy consists of an Sn-matrix containing fine Cu6Sn5 particulates ranging in size from 0.005 µm to 0.05 µm, and larger (> 2,000 µm) rod-like Ag3Sn precipitate particles. This microstructure strengthens the SnCuAg alloy through a precipitate dispersion alloy strengthening mechanism and gives it superior solder fatigue and creep resistance properties compared to eutectic solder or other lead-free alternatives. This alloy has also demonstrated excellent compatibility with existing tin-lead solder reflow processes and with lead-free soldering processes.

For SOIC packages, NiPdAu plating finish is offered as the RoHS-compliant alternate solution. This finish has been used in high volumes for SOIC, SSOP and TSSOP packages in the industry and is available as pre-plated lead frames through major lead frame suppliers. This surface finish has demonstrated excellent solder joint reliability and compatibility with eutectic and lead-free solders.

Q1: Does Intel FPGA device comply with EU RoHS II?  

A: Intel offers device packages that are fully compliant with the restriction of hazardous substances (RoHS) directive adopted by the European Union. Intel's Pb-free products are in full compliance with current RoHS II (Directive 2011/65/EU) requirements.

Q2: Where can I find Material Declaration report for a given OPN?

A: IPC has established a common platform for Material Composition Declaration. Intel has adopted the IPC-1752 reporting format for material declaration data exchange between Intel and the downstream supply-chain participants.

For IPC reports, please go to our Material Declaration site:

https://www.altera.com/support/quality-and-reliability/environmental/material-decl.html

Q3: Where can I find ROHS certificate for a given OPN?

A: You can obtain the ROHS II declaration of conformity by entering Intel ordering part number in the Intel website below.

https://www.altera.com/support/quality-and-reliability/environmental/material-decl.html

Q4: Would you please provide ROHS compliance letter?

A: You can download customer letter in Intel website below.

https://www.altera.com/en_US/pdfs/devices/common/leadfree/rohs-letter.pdf

Q5: Do you have ROHS II report that covers additional 4 substances to meet 2015/863/EU directive?

A: Intel now plans to prepare for ROHS additional substances in 2015/863/EU below before the 22 July 2019 deadline.

Bis(2-ethylhexyl) phthalate (DEHP) (0.1 %)

Butyl benzyl phthalate (BBP) (0.1 %)

Dibutyl phthalate (DBP) (0.1 %)

Diisobutyl phthalate (DIBP) (0.1 %)

Q6: What do RoHS5 and RoHS6 mean? What is difference between Intel FPGA product with RoHS5 and RoHS6?

A: When a company uses the term RoHS 5 or RoHS 6 or ROHS 6/6, etc, the company has to provide the definition. The reason is that these are not industry terminology. This is a company specific vocabulary.

For Intel ROHS compliance, please refer to our website below.

https://www.altera.com/support/quality-and-reliability/environmental/lead-free/rel-lead-free.html

Q7: How do I know if the device is a leaded or lead free device?

A:

1. For FPGA, the OPN contains the denoting info. Please refer to the table below.

Device OPN without suffix i.e. EP1C6Q240C8

 

OPN with suffix “N” i.e. EP2S60F672I4N OPN with suffix “G” i.e. 5AGXFB3H4F35I3G
Wire Bond Leaded Lead free NA
Flip Chip Leaded Solder bump contains lead which is under ROHS exemption 15. It is ROHS compliant device. Lead free

 

2. For Enpirion, all Enpirion devices are lead free.

https://www.altera.com/support/quality-and-reliability/environmental/lead-free/rel-power-lead-free.html

Q8: In the case that exemption15 is expired, do you have alternative device for Flip Chip?

A: Exemption 15 Working Group petitioning EU extension for boundary conditions for extension. Therefore, the Flip Chip devices with die > 300 mm2 or die using 90nm or older process will be kept with no change if it is granted by EU.

For other Flip Chip devices, Intel will have a qualified solution. RoHS-compliant flip-chip devices with no exemptions are denoted by suffix “G”.

Q9: What is ROHS status for “G” device?

A: It is ROHS compliant flip chip.

Q10: What is Exemption 15 and how does it relate to ROHS Compliance?

A: Exemption 15 allowed semiconductor manufacturers to use leaded bumps to attach the silicon die to the substrate. This creates a packaged semiconductor product. Intel supports two types of lead free products. The first are parts that require exemption 15 and they are designated with an N in the ordering code. The second are parts that do not require exemption 15 and they are designated with a G in the ordering code.

Q11: Will RoHS-compliant packages obsolete leaded packages?

A: No, Intel will continue to sell and support devices with both RoHS-compliant and leaded package options. However all parts remain subject to a yearly end-of-life review, the results of which may impact future availability of some device and package combinations.

Q12: Can I use both leaded and RoHS-compliant parts on the same board?

A: Although it is not recommended, we have seen many customers successfully use both leaded and RoHS-compliant parts on the same board. There are high-volume consumer products that are currently using both types of packages. However, using both leaded and RoHS-compliant parts together will add to the complexity of the manufacturing process. Customers are advised to perform thorough evaluation before going into volume production.

Q13: What issues should I be concerned about when dealing with RoHS-compliant products?

A: You should note that some alternative compounds have a higher melting point than the tin-lead compound. As such, a substantially higher re-flow temperature may be required for RoHS-compliant alternatives. Manufacturing equipment to handle material with these high temperatures, such as a multizone oven, is costly, and will require significant investment from your company or your contract manufacturer.

In addition, since RoHS-compliant is still a relatively new technology, the industry is still in the process of compiling its long-term reliability data. However, Intel has extensive expertise in this field, and works closely with customers to ensure a successful transition to RoHS-compliant products.

Q14: How do I order Intel RoHS-compliant products?

A: All devices on Intel RoHS-Compliant Product Offering list are standard RoHS-compliant devices, and are available directly from your distributor or through your normal sales channel. ROHS-compliant devices with leaded bumps (requires exemption 15) will be marked with a "N" and ROHS-compliant devices with unleaded bumps will be marked with a "G".

For Enpirion PowerSoCs, all Enpirion devices are lead free.  No special ordering codes or suffixes are required for lead-free product ordering. 

Q15: What are the special terms regarding devices not available in the RoHS-compliant "G" option (Products that do not require Exemption 15)?

A: Intel high volume products are already offered as RoHS-compliant solutions. For limited usage devices, Intel requires a volume commitment from a customer for the RoHS-compliant option. Please contact your local Intel sales representative for details.

Q16: Eventually, I will need to transition to RoHS-compliant products after the exemption expires, but I do not have a set date. Is there anything I need to do right now?

A: Intel RoHS-Compliant Product Offering list provides an easy way to check the availability of devices you will need. As long as the device you want is listed on the availability sheet, no additional work is required until your transition date is set.