Article ID: 000074532 Content Type: Troubleshooting Last Reviewed: 02/15/2023

Do Intel® MAX® 10 devices have an exposed pad at the bottom of the 144-pin EQFP (E144) package?

Environment

BUILT IN - ARTICLE INTRO SECOND COMPONENT
Description

Yes, Intel® MAX®10 devices in the E144 package have an exposed pad at the bottom of the package. The exposed ground pad is used for electrical connectivity and not for thermal purposes. Therefore, you must connect the exposed ground pad to the ground plane of the PCB. 

To know the exposed pad dimensions,  refer to dimensions D2 and E2 for the E144 package, which can be found on the Package and Thermal Resistance (MAX 10) page.

 

 

Resolution

The documentation has been updated.

Related Products

This article applies to 1 products

Intel® MAX® 10 FPGAs