Thermal Management in Intel® Stratix® 10 Devices (OTMS10)

32 Minutes Online Course

Course Description

Thermal management is an important aspect of implementing today's high-speed devices. The more power put into a device, the more heat that must be removed. Most FPGA devices consist of a single monolithic silicon die, making the process of designing a cooling solution focused on that single die. Intel® Stratix® 10 FPGA devices, however, consist of a core die and multiple transceiver dies, each of which affect the overall thermal profile of the entire device. In this training, you'll learn about the thermal factors involved with a multi-die device and how the new Intel Stratix 10 Early Power Estimator (EPE) makes it easy to calculate these factors based on your design and transceiver channel use. Use these calculated factors to make decisions about your FPGA design and cooling solution.

At Course Completion

You will be able to:

  • Understand the differences in thermal management between Intel® Stratix® 10 devices and previous device families
  • Know how to use the Intel Stratix 10 device Early Power Estimator (EPE) spreadsheet to calculate thermal factors for a design
  • Take the results from the EPE to make decisions on the FPGA design and the device's cooling solution

Skills Required

  • Familiarity with the thermal management of Intel® FPGA devices
  • Familiarity with the Early Power Estimator (EPE)
  • Familiarity with device cooling solution modeling and design

Follow-on Courses

Upon completing this course, we recommend the following courses (in no particular order):

Applicable Training Curriculum

This course is part of the following Intel FPGA training curriculum:

Class Schedule

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