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Lotus Microsystems Thermal Guides

Lotus Microsystems

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LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated, silicon-based thermal jumpers. They are designed to guide heat away from hot electronic components, toward heat sinks or cooler areas (such as ground planes), without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in scenarios with limited or no direct access to a ground plane or heat sink, such as high-side switch, current sense resistors, power inductors in SMPS and laser diodes Silicon, as an alternative to traditional ceramic materials, offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well as reliable manufacturing process. The incorporation of LTG devices both improves circuit reliability and reduces the overall cost of a thermal management system. They are currently available in five standard EIA sizes (0201, 0402, 0603, 0805 and 1206) as lateral ...

LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated, silicon-based thermal jumpers. They are designed to guide heat away from hot electronic components, toward heat sinks or cooler areas (such as ground planes), without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in scenarios with limited or no direct access to a ground plane or heat sink, such as high-side switch, current sense resistors, power inductors in SMPS and laser diodes Silicon, as an alternative to traditional ceramic materials, offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well as reliable manufacturing process. The incorporation of LTG devices both improves circuit reliability and reduces the overall cost of a thermal management system. They are currently available in five standard EIA sizes (0201, 0402, 0603, 0805 and 1206) as lateral vesion (ST) and as a lateral/vertical one (CT), as well as custom versions.

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Offering Brief

Offering Brief

Device Family Agilex™ 3 FPGA C-Series, Agilex™ 5 FPGA D-Series, Agilex™ 5 FPGA E-Series, Agilex™ 7 FPGA F-Series, Agilex™ 7 FPGA I-Series, Agilex™ 7 FPGA M-Series, Agilex™ 9 FPGA Direct RF-Series, Arria® 10 GT FPGA, Arria® 10 GX FPGA, Arria® 10 SX FPGA, Arria® II GX FPGA, Arria® II GZ FPGA, Arria® V GT FPGA, Arria® V GX FPGA, Arria® V GZ FPGA, Arria® V ST FPGA, Arria® V SX FPGA, Cyclone® 10 GX FPGA, Cyclone® 10 LP FPGA, Cyclone® II FPGA, Cyclone® III FPGA, Cyclone® III LS FPGA, Cyclone® IV E FPGA, Cyclone® IV GX FPGA, Cyclone® V E FPGA, Cyclone® V GT FPGA, Cyclone® V GX FPGA, Cyclone® V SE FPGA, Cyclone® V ST FPGA, Cyclone® V SX FPGA, MAX® 10 FPGA, MAX® II CPLD, MAX® II Z CPLD, MAX® V CPLD, Stratix® 10 AX FPGA, Stratix® 10 DX FPGA, Stratix® 10 GX FPGA, Stratix® 10 SX FPGA, Stratix® 10 TX FPGA, Stratix® III FPGA, Stratix® IV E FPGA, Stratix® IV GT FPGA, Stratix® IV GX FPGA, Stratix® V E FPGA, Stratix® V GS FPGA, Stratix® V GX FPGA
Offering Status Production

LTG020180CT

LTG040280CT

LTG060380CT

LTG080580CT

LTG120680CT

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