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TEI0187 Agilex® 5 E-Series SoC Module

Trenz Electronic GmbH

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TEI0187 is a System-on-Module based on Agilex® 5 E-Series SoC devices, combining FPGA fabric and an integrated Hard Processor System (HPS).

The current reference configuration, TEI0187-02-T4E111A, uses an A5ED065BB32AE4S device in the B32A package. It provides 1 GB of 32-bit LPDDR4 memory for the HPS and a separate 1 GB of 32-bit LPDDR4 memory for the FPGA fabric, together with 256 MB QSPI flash, 8 GB eMMC and two EEPROMs.

The 52 × 76 mm module connects to a carrier board through three 240-pin Samtec AccelerateHD ADM6 connectors. Interfaces include Gigabit Ethernet through an onboard RGMII PHY, USB 2.0 through an ULPI PHY, MIPI D-PHY and FPGA and HPS I/O. Revision 02 includes TPM 2.0.

The offering targets industrial and general test applications. Device, memory and I/O configurations depend on the selected ordering part number. The delivery scope is the module only.

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Key Features

  • Agilex® 5 E-Series SoC with FPGA fabric and HPS
  • 96 differential / 192 single-ended HSIO, 120 HVIO and 19 HPS I/O
  • 52 × 76 mm System-on-Module
  • 3 × 240-pin Samtec AccelerateHD ADM6 connectors
  • Separate 32-bit LPDDR4 memories: 1 GB for HPS and 1 GB for FPGA fabric
  • 256 MB QSPI flash
  • 8 GB eMMC in revision 02
  • Gigabit Ethernet PHY with RGMII
  • USB 2.0 PHY with ULPI
  • MIPI D-PHY with 4 data lanes
  • TPM 2.0 in revision 02
  • 24 transceivers in the reference configuration
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Offering Brief

Offering Brief

Device Family Agilex® 5 FPGA E-Series
Offering Status Production
Device OPN(s) on Board A5ED065BB32AE4S
Form Factor 52 x 76 mm
Power 5 V or 12 V input supply.
Interfaces Gigabit Ethernet PHY (RGMII); USB 2.0 PHY (ULPI); USB 3.1 Gen1 support using one transceiver; MIPI D-PHY with 4 data lanes; 24 transceivers in the reference configuration; 96 differential / 192 single-ended HSIO; 120 HVIO; 19 HPS I/O supporting inter
Memory Reference configuration: 1 GB LPDDR4 for HPS and 1 GB LPDDR4 for FPGA fabric, both 32-bit; 256 MB QSPI flash (2 Gbit); 8 GB eMMC; 2 Kbit and 128 Kbit EEPROMs.
Connectors 3 × 240-pin Samtec AccelerateHD ADM6 board-to-board connectors.
Switches & LEDs No switches, push buttons or LEDs on the module.
Latest Quartus Version Supported 26.1.1

TEI0187 SoC module

Ordering Information

TEI0187

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Market Segment and Sub-Segments

Robotics-252x228

Industrial

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Industrial

Industrial / Manufacturing

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Digital Test Vision

Test

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Test

Other Test

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