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TEI0135 is a System-on-Module based on Agilex®3 with FPGA fabric and an integrated Hard Processor System (HPS). The roadmap specifies a B23C package and planned device configurations with 100K to 135K logic elements.
The 40 × 56.4 mm module uses two Samtec ADM6 board-to-board connectors. Planned memory resources include up to 8 GB LPDDR4, 512 Mbit (64 MB) QSPI flash and up to 64 GB eMMC. Additional features include two Gigabit Ethernet PHYs, a four-lane MIPI CSI-2 receive interface and TPM 2.0. The roadmap lists 48 HSIO, 120 HDIO and 12 PS MIO.
The offering targets industrial and test applications. Memory capacities depend on the planned configuration. The product is in development, and specifications remain subject to change. The delivery scope is the module only.
