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TEI0140 Agilex® 3 Makerboard

Trenz Electronic GmbH

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TEI0140 is a makerboard based on Agilex® 3 FPGA devices without an integrated Hard Processor System (HPS). The roadmap specifies a B18A package and planned device configurations with 25K to 135K logic elements.

The 35 × 73 mm board provides 84 HVIOs, two 50-pin header connectors and a CRUVI-HS connector. Planned memory resources include up to 4 GB LPDDR4 and 512 Mbit (64 MB) QSPI flash. An embedded USB Blaster III provides JTAG and UART connectivity.

The offering targets consumer applications and FPGA prototyping. Memory configurations depend on the planned variant. The product is in development, and specifications remain subject to change. The delivery scope is the makerboard only.

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Key Features

  • Agilex® 3 FPGA
  • Planned device configurations: 25K–135K logic elements, B18A package
  • 35 × 73 mm makerboard
  • Up to 4 GB LPDDR4, configuration-dependent
  • 512 Mbit (64 MB) QSPI flash
  • 84 HVIOs
  • 2 × 50-pin header connectors
  • CRUVI-HS connector
  • Embedded USB Blaster III with JTAG and UART
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Offering Brief

Offering Brief

Device Family Agilex® 3 FPGA C-Series
Offering Status Development
Device OPN(s) on Board A3CZ025BB18AI7S
Form Factor 35 x 73 mm
Power 5 V via USB-C.
Interfaces 84 HVIOs; CRUVI-HS expansion; JTAG and UART via embedded USB Blaster III.
Memory Planned, configuration-dependent: up to 4 GB LPDDR4; 512 Mbit (64 MB) QSPI flash.
Connectors 2 × 50-pin header connectors; 1 × CRUVI-HS connector; USB-C power input.
Switches & LEDs 1 user push button; 2 RGB LEDs; 1 additional LED.
Latest Quartus Version Supported 26.1.1

TEI0140 makerboard

Ordering Information

TEI0140

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Market Segment and Sub-Segments

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Consumer

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Consumer

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