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Trenz Electronic GmbH

About Trenz Electronic GmbH

Program Level

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Certified Engineers

17

Languages

English, German

Trenz Electronic has been active as a development service provider in the electronics industry since 1992. Our services range from design-in support to complete design solutions.

We accompany the entire development process - from product specification, hardware and software development to prototyping and series production. Many of our products are compatible with common form factors.

We also offer SoM solutions specifically for the automotive industry and demanding high-end applications.

Our customers benefit in particular from our extensive expertise in the field of embedded systems, both in industrial applications and in PC-based control and measurement systems. Our development service is complemented by FPGA- and MCU-based development boards and tools. If one of our standard FPGA boards does not meet the specific requirements, we offer customised adaptations via our in-house engineering design service.

Our portfolio is rounded off by our in-house Electronic Manufacturing Service (EMS) and the global distribution of FPGA and SoC modules, carrier boards, starter kits, FMC and CPCIS cards and development boards.

Headquarters: Beendorfer Straße 23, Hüllhorst, Nordrhein-Westfalen, 32609, Germany

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Offering Type

offering type links Acceleration / AI / Cloud
offering type links Boards / SOMs / Dev Kits
offering type links Design Services

Offerings

TEI0187 is an Agilex® 5 E-Series System-on-Module for industrial and test applications. The 52 × 76 mm module combines FPGA fabric and HPS with separate LPDDR4 memories, QSPI flash, Gigabit Ethernet and three Samtec ADM6 board-to-board connectors. Revision 02 adds eMMC storage and TPM 2.0.

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TEI0009 is a Cyclone® 10 LP FPGA reference kit for industrial development and general test applications. Revision 03 combines a 55 kLE FPGA with SDRAM, HyperRAM, flash memory, dual Fast Ethernet, analog I/O and an integrated USB programmer.

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TEI0135 is an Agilex®3 SoC module in development for industrial and test applications. The planned 40 × 56.4 mm design combines FPGA fabric and HPS with LPDDR4 memory, QSPI flash, eMMC storage, two Gigabit Ethernet PHYs, a MIPI CSI-2 receive interface and TPM 2.0.

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TEI0140 is an Agilex® 3 FPGA makerboard in development for consumer applications and prototyping. The planned 35 × 73 mm board features up to 4 GB LPDDR4, QSPI flash, two 50-pin headers, a CRUVI-HS connector and an embedded USB Blaster III for JTAG and UART.

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