agilex2x

Agilex 2X - Built for the Future​ of Intelligent Systems​

  • FPGA
  • SoC

Agilex 2X is Altera’s next-generation FPGA and SoC, designed holistically for modern application challenges and built for the future of intelligent systems. 

Agilex 2X FPGAs and SoCs

Agilex 2X is Altera’s next-generation programmable portfolio for the future of intelligent systems. Combining architecture leadership with portfolio-wide scalability and a unified agentic design experience, Agilex 2X delivers optimized capabilities that enable customers build solutions across the FPGA landscape that scale performance and capacity on one end and low power and I/O density on the other, all within the same portfolio.

The Agilex 2X Approach

Solution-Scalability

End-to-End Scalability to Optimize System Design

The Agilex 2X portfolio spans power- and cost-optimized, mid-range, and high-performance programmable devices, providing the right combination of performance, power, connectivity, integration, and form factor for a broad range of intelligent systems. 

Neon Holographic Chip Architecture

Leadership Programmable Architecture Across the Portfolio

Advanced programmable architectures across the Agilex 2X portfolio are engineered for sustained performance and efficiency, combining innovations in fabric, connectivity, compute, and hardened system functions to help deliver optimized system results.

QuartusIQ-technology

Unified Agentic Design Flow with Future Readiness

Quartus® Prime Pro and QuartusIQ AI expert companion deliver a unified agentic design experience with industry-leading ease of use and QoR, common development tools, and simplified design migration to make the portfolio easier to adopt, reuse, and evolve.

Agilex 2X Product Portfolio

Common Questions

Agilex 2X combines an advanced fabric optimized to provide the best performance while keeping minimizing leakage current. On top of that, system integration, hardened functions, connectivity, and data movement deliver more useful application performance within demanding power and thermal envelopes.