Agilex™ 9 SoC FPGA — Direct RF-Series

Direct RF-Series devices integrate FPGAs and industry-leading high-performance wideband data converters and medium-band data converters with high-fidelity performance. These Direct RF SoC FPGAs use 10 nm SuperFin process technology, Quad-core Arm processors, ultra-low converter interface latency, transceiver rates up to 58 Gbps, and provide high channel density packages to address difficult size, weight, and power constraints.

Agilex™ 9 FPGAs and SoC FPGAs Direct RF-Series Product Brief

Optimized Edge Solutions for Radio Frequency Applications

Up to eight channels of

64 Gsps

ADC/DAC converters integrated with an SoC FPGA

Up to sixteen channels of

12 Gsps

DAC converters and 20 channels of 4 Gsps ADC converters integrated with an SoC FPGA

Converters combined with up to

25 TFLOPS

of digital signal processing performance (FP16)

Benefits

High RF Performance with Wideband Frequency Agility

Enables Direct RF signal processing that simplifies system architecture and reduces latency. Multi-channel converters with an RF bandwidth of 36 GHz and an instantaneous RF bandwidth of 32 GHz provide the ability to retune receivers and transmitters quickly while providing simultaneous wideband and narrowband tracking.

Optimized for Lower System Footprint and Power Consumption

Provides high compute capabilities in a compact form factor with efficient power usage, making it well-suited for edge computing and SWaP-constrained applications.

Lower Total Cost of Ownership and Risk

Significantly reduces the system-level cost by eliminating a substantial amount of external analog circuitry and associated components. Along with the benefits of chiplet-based architecture, the RF toolchain integrated into Quartus Prime Software enables system-level debug, which lowers schedule risk and accelerates time to market.

Key Features

High-Performance Data Converters (ADCs/DACs)

Offers Direct RF sampling rates of up to 64 Gsps and eliminates the need for traditional analog RF front end components.

Heterogenous Chiplet-Based Design

Utilizes Embedded Multi-Die Interconnect Bridge (EMIB) and Advanced Interconnect Bus (AIB) tile interconnect technology to integrate high-performance ADCs and DACs with Agilex 7 and Stratix 10 FPGA die in a single package.

Advanced Programmable Logic and I/O Capabilities

Provides a high density of logic elements and DSP blocks for compute-heavy workloads like signal processing and AI, along with an ARM based processor and Secure Device Manager.

Transceivers and Memory Support

Supports high-speed transceivers and memory interfaces, enabling fast data movement across the device.