Agilex™ 9 SoC FPGA Direct RF-Series

Direct RF-Series devices integrate FPGAs and industry-leading high-performance wideband data converters and medium-band data converters with hi-fidelity performance. These Direct RF SoC FPGAs use 10 nm SuperFin process technology, Quad-core Arm processors, ultra-low converter interface latency, transceiver rates up to 58 Gbps, and provide high channel density packages to address difficult size, weight, and power constraints. 

 Agilex™ 9 FPGAs and SoC FPGAs Direct RF-Series Product Table

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Optimized Edge Solutions for Radio Frequency Applications

Up to eight channels of

64 Gsps

ADC/DAC converters integrated with an SoC FPGA

Up to sixteen channels of

12 Gsps

DAC converters and 20 channels of 4 Gsps ADC converters integrated with an SoC FPGA

Converters combined with up to

25 TFLOPS

of digital signal processing performance (FP16)

Benefits

High-Performance Wideband Frequency Agility

Multi-channel converters with an RF bandwidth of 36 GHz and an instantaneous RF bandwidth of 32 GHz provide the ability to retune receivers and transmitters quickly while providing simultaneous wideband and narrowband tracking.

Low Latency and Power Consumption

Embedded Multi-die Interconnect Bridge (EMIB) and Advanced Interconnect Bus (AIB) tile interconnect technology to integrate RF-capable ADCs and DACs with Agilex™ 9 FPGA monolithic die. With programmable hardened IP, provide low latency and power consumption when converting between the analog and digital domains.

Total Cost of Ownership and Risk

These devices significantly impact the system-level size and cost (eliminating a substantial amount of external analog circuitry, associated power supplies, cooling, and chassis). This integrated and digital solution increases system reliability, which lowers system costs. An RF tool chain integrated into Quartus® Prime Software will lower risk and time to market.

Key Features

Advanced Interconnect Bus (AIB)

AIB is a very wide, multi-channel, high-speed, low-power, and low-latency parallel bus with a simple clocked interface bus protocol designed specifically to meet the requirements for die-to-die interconnect. The CHIPs alliance has published AIB as a standard.

Embedded Multi-Die Interconnect Bridge (EMIB)

Low latency and low power solutions due to Embedded Multi-Die Interconnect Bridge (EMIB), Advanced Interconnect Bus (AIB) tile interconnect technology, high-performance ADC and DAC with hardened IP, and Agilex™ 9 FPGA monolithic die.

A Variety of Additional I/O Functionality

Different semiconductor chiplets or tiles can provide FPGAs with a variety of additional I/O functionality including high bandwidth memory (HBM) DRAM, PCIe 4.0 and 5.0, and 58/116 Gbps serial transceiver ports that allow these FPGAs to interface with a wide variety of devices.

Applications

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Military, Aerospace, and Government

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Products & Ordering

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Start Developing with Agilex™ 9 Direct RF-Series

Build RF, radar, and defense systems with ultra-fast direct RF processing. Contact sales for availability and product details.

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