FPGA Solutions

Data Center

Programmable acceleration for the AI data center: networking, storage, platform management, and inference on Altera FPGAs.

The Programmable Layer of the AI Data Center

Between the CPU, the xPU, and the wire, there is work software can’t do fast enough and ASICs can’t change fast enough. Altera FPGAs run it in hardware: line rate, deterministic latency, reprogrammable as standards move.

Agilex® 7 pairs hardened PCIe 5.0, CXL, and 400G Ethernet on every F-Tile with in-package HBM2e for the data path. Agilex 5, Agilex 3, and MAX® 10 cover every platform management socket from power sequencing to a consolidated BMC with hardware root of trust.

Agilex FPGA SmartNIC card with a lit FPGA die, representing the data center data path
Agilex FPGA SmartNIC card with a lit FPGA die, representing the data center data path

The Challenges, and Why FPGA

The Challenge

Latency Drifts Under Load

Software data paths add interrupts, context switches, and jitter; tail latency grows with scale.

Why FPGA

Deterministic, Ultra-Low Latency

Parallel hardware pipelines. No interrupts, no context switches, no jitter. Wire speed at any packet size.

The Challenge

Standards Change Faster Than Silicon

New AI models, transports, and security standards arrive on a cadence fixed silicon cannot follow.

Why FPGA

Hardware-as-Code

Reprogram deployed silicon for new models, transports, and standards. A bitstream update, not a board respin.

The Challenge

Interface Sprawl

Legacy, current, and emerging interfaces coexist in one rack and need bridging without extra parts.

Why FPGA

Universal I/O

Hardened PCIe 5.0, CXL, and 400G Ethernet with transceivers to 116 Gbps bridge every generation in one device.

The Challenge

Memory Wall

Memory-bound workloads, from inference to storage, are limited by bus speed, not compute.

Why FPGA

Memory-Class Devices

Agilex 7 M-Series pairs in-package HBM2e with DDR5 and CXL so memory-bound workloads run at memory speed.

Why Altera

Highest Memory Bandwidth FPGA

Agilex 7 M-Series pairs in-package HBM2e with DDR5 and a 7.52 Tb/s network-on-chip.

Chiplet Architecture, Built for Your I/O

R-Tile, F-Tile, and E-Tile over EMIB: pick the transceiver mix that matches the workload.

Open Software Stack

Open FPGA Stack for PCIe cards, P4 Suite for packet processing, FPGA AI Suite for inference IP.

Production Partner Ecosystem

Accelerator boards, AI NICs, and memory and networking IP from the Altera Solutions Partner network.

Reference Platforms

Altera development kits with Open FPGA Stack (OFS) support: the boards data center designs start on.

Agilex 7 I-Series Development Kit

The 400G reference for AI NICs, DPUs, and CXL: OFS PCIe-attach FIM on R-Tile Gen5 x16, two QSFP-DD cages, and an FPGA AI Suite inference example.

Vendor and device: Altera, AGIB027R29A1E1VB

  • PCIe 5.0 x16 and CXL via MCIO
  • 2x QSFP-DD: 2x400G, 2x200G, or 8x25G
  • 2x DDR4 32 GB plus DIMM sockets
  • OFS 2025.1 FIM, OPAE, DFL drivers
rp-agilex7-iseries-devkit
rp-agilex7-iseries-devkit

Agilex 7 M-Series HBM2e Development Kit

The memory reference for inference and storage acceleration: in-package HBM2e beside DDR5, PCIe 5.0 x16 host attach, 3x F-Tile for line-rate Ethernet.

Vendor and device: Altera, AGMF039R47A1E2VC

  • 32 GB in-package HBM2e
  • 16 GB DDR5 RDIMM plus DDR5 components with ECC
  • PCIe 5.0 x16 via MCIO, 3x F-Tile, 1x R-Tile
  • FPGA AI Suite and NoC design examples
rp-agilex7-mseries-hbm2e-devkit
rp-agilex7-mseries-hbm2e-devkit

Agilex 7 F-Series Transceiver-SoC Development Kit

The SmartNIC and platform reference: the same F-Series SoC device as the OFS N6001-PL platform, with QSFP-DD, QSFP28, PCIe Gen4 x16, and HPS daughter cards for embedded Linux.

Vendor and device: Altera, AGFB014R24B2E2V with Arm HPS

  • PCIe 4.0 x16, 16 P-Tile and 16 E-Tile channels
  • QSFP-DD and QSFP28 cages, up to 58G PAM4
  • 8 GB DDR4 plus SODIMM
  • OFS 2025.1 FIM, OPAE, HPS OOBE
rp-agilex7-fseries-devkit
rp-agilex7-fseries-devkit

Get Started

Data Center Applications

Common Questions

Between the CPU, the xPU, and the wire: in the NIC, the storage controller, the board management controller, and beside the xPU as a memory orchestrator. Each is a data-path job that benefits from line rate, deterministic latency, and the ability to reprogram as standards change.

Talk to an Altera Data Center Expert

Bring us the workload. We will map it to a device, an IP stack, and a partner board.