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Lotus Microsystems Thermal Guides

Lotus Microsystems

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LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated, silicon-based thermal jumpers. They are designed to guide heat away from hot electronic components, toward heat sinks or cooler areas (such as ground planes), without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in scenarios with limited or no direct access to a ground plane or heat sink, such as high-side switch, current sense resistors, power inductors in SMPS and laser diodes Silicon, as an alternative to traditional ceramic materials, offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well as reliable manufacturing process. The incorporation of LTG devices both improves circuit reliability and reduces the overall cost of a thermal management system. They are currently available in three standard EIA sizes (0402, 0603, and 0805), as well as custom sizes.

LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated, silicon-based thermal jumpers. They are designed to guide heat away from hot electronic components, toward heat sinks or cooler areas (such as ground planes), without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in scenarios with limited or no direct access to a ground plane or heat sink, such as high-side switch, current sense resistors, power inductors in SMPS and laser diodes Silicon, as an alternative to traditional ceramic materials, offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well as reliable manufacturing process. The incorporation of LTG devices both improves circuit reliability and reduces the overall cost of a thermal management system. They are currently available in three standard EIA sizes (0402, 0603, and 0805), as well as custom sizes.

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Offering Brief

Offering Brief

Device Family Agilex™ 3 FPGA C-Series, Agilex™ 5 FPGA D-Series, Agilex™ 5 FPGA E-Series, Agilex™ 7 FPGA F-Series, Agilex™ 7 FPGA I-Series, Agilex™ 7 FPGA M-Series, Agilex™ 9 FPGA Direct RF-Series, Arria® 10 Bare Die, Arria® 10 GT FPGA, Arria® 10 GX FPGA, Arria® 10 SX FPGA, Arria® II GX FPGA, Arria® II GZ FPGA, Arria® V GT FPGA, Arria® V GX FPGA, Arria® V GZ FPGA, Arria® V ST FPGA, Arria® V SX FPGA, Cyclone® 10 GX FPGA, Cyclone® 10 LP FPGA, Cyclone® II FPGA, Cyclone® III Bare Die, Cyclone® III FPGA, Cyclone® III LS FPGA, Cyclone® IV E FPGA, Cyclone® IV GX FPGA, Cyclone® V E FPGA, Cyclone® V GT FPGA, Cyclone® V GX FPGA, Cyclone® V SE FPGA, Cyclone® V ST FPGA, Cyclone® V SX FPGA, MAX® 10 FPGA, MAX® II CPLD, MAX® II Z CPLD, MAX® V CPLD, Mustang Mesa, Stratix® 10 AX FPGA, Stratix® 10 Bare Die, Stratix® 10 DX FPGA, Stratix® 10 GX FPGA, Stratix® 10 SX FPGA, Stratix® 10 TX FPGA, Stratix® III FPGA, Stratix® IV E FPGA, Stratix® IV GT FPGA, Stratix® IV GX FPGA, Stratix® V E FPGA, Stratix® V GS FPGA, Stratix® V GX FPGA, eASIC™ N3X Devices, eASIC™ N3XS Devices, eASIC™ N5X Devices
Offering Status Production

LTG020180CT

LTG040280CT

LTG060380CT

LTG080580CT

LTG120680CT

Market Segment and Sub-Segments