LTG devices from Lotus Microsystems are thermally
conductive yet electrically isolated, silicon-based thermal
jumpers. They are designed to guide heat away from
hot electronic components, toward heat sinks or cooler
areas (such as ground planes), without establishing an
electrical connection. LTG devices significantly enhance
thermal conductivity, particularly in scenarios with limited
or no direct access to a ground plane or heat sink, such
as high-side switch, current sense resistors, power
inductors in SMPS and laser diodes
Silicon, as an alternative to traditional ceramic materials,
offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well
as reliable manufacturing process. The incorporation of
LTG devices both improves circuit reliability and reduces
the overall cost of a thermal management system. They
are currently available in three standard EIA sizes (0402,
0603, and 0805), as well as custom sizes.
LTG devices from Lotus Microsystems are thermally
conductive yet electrically isolated, silicon-based thermal
jumpers. They are designed to guide heat away from
hot electronic components, toward heat sinks or cooler
areas (such as ground planes), without establishing an
electrical connection. LTG devices significantly enhance
thermal conductivity, particularly in scenarios with limited
or no direct access to a ground plane or heat sink, such
as high-side switch, current sense resistors, power
inductors in SMPS and laser diodes
Silicon, as an alternative to traditional ceramic materials,
offers a cost-effective substrate with high thermal conductivity and excellent thermomechanical properties, as well
as reliable manufacturing process. The incorporation of
LTG devices both improves circuit reliability and reduces
the overall cost of a thermal management system. They
are currently available in three standard EIA sizes (0402,
0603, and 0805), as well as custom sizes.