partner-offering-banner.png

Agilex™ 3 Development Kit: G71D

iWave Global

Select

The iG-G71D is a versatile development kit designed to evaluate and accelerate design implementation on Agilex™ 3 SoC FPGAs. It provides a rich set of high-speed and peripheral interfaces tailored for edge AI, industrial control, and embedded networking applications. The platform features both 2.5G and Gigabit Ethernet ports via RJ45 MagJack connectors, offering robust connectivity options for real-time networking and low-latency communication.

To support flexible expansion and prototyping, the kit includes a PCIe Gen3 x4 interface, USB 3.0 and USB 2.0 via Type-C connector, an FMC+ connector supporting LVDS/IOs, and a PMOD header for peripheral add-ons. Additionally, a 20-pin HPS header exposes key interfaces such as I2C, SPI, and GPIOs, while the integrated JTAG header supports easy debugging and FPGA programming. The G71D development kit offers developers an efficient and comprehensive platform to evaluate Agilex™ 3 capabilities and accelerate the deve...

The iG-G71D is a versatile development kit designed to evaluate and accelerate design implementation on Agilex™ 3 SoC FPGAs. It provides a rich set of high-speed and peripheral interfaces tailored for edge AI, industrial control, and embedded networking applications. The platform features both 2.5G and Gigabit Ethernet ports via RJ45 MagJack connectors, offering robust connectivity options for real-time networking and low-latency communication.

To support flexible expansion and prototyping, the kit includes a PCIe Gen3 x4 interface, USB 3.0 and USB 2.0 via Type-C connector, an FMC+ connector supporting LVDS/IOs, and a PMOD header for peripheral add-ons. Additionally, a 20-pin HPS header exposes key interfaces such as I2C, SPI, and GPIOs, while the integrated JTAG header supports easy debugging and FPGA programming. The G71D development kit offers developers an efficient and comprehensive platform to evaluate Agilex™ 3 capabilities and accelerate the development of compact, low

Key Features

  • Agilex™ 3 C-Series family with M16A Package
  • 32Bit 2GB LDDR4 for HPS
  • 32GB eMMC (Expandable) 1Gb QSPI Configuration flash and EEPROM
  • 4 x transceivers up to 12.5Gbps for Group C devices.
  • Up to 135K Logic Elements
  • 2.5G Ethernet PHY Transceiver
  • JTAG Header
Expand Close
Keyfeatures main image

Offering Brief

Offering Brief

Device Family Agilex® 3 FPGAs and SoC FPGAs C-Series
Offering Status Sampling
Device OPN(s) on Board A3CW135BM16AI6S;A3CW135BM16AE6SR0
Form Factor 120mm x 120mm
Power 12V
Interfaces FMC+ High Pin count x 1 (FMC+ supports only DIFF/SE IOs)
PCIe x4 connector x 1, PMOD, Gigabit Ethernet through RJ45MagJack, USB3.0 OTG, Debug UART, 60 Pin Header (for HPS GPIOs, FPGA IOs, HPS SPI and H2F I2C), Micro SD (optional), JTAG
Memory 32GB eMMC (Expandable), 1Gb QSPI Configuration flash, EEPROM
Connectors Board to Board Connectors Interfaces
Switches & LEDs Boot switch and Statues LED
Latest Quartus Version Supported 25.1.1

System on Module & Development Kit

Ordering Information

Documentation & Resources

Market Segment and Sub-Segments