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FPGA Cloud Connectivity Kit 2.0

Terasic Inc.

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Built on the popular Terasic DE10-Nano, the FPGA Cloud Connectivity Kit combines the versatility of an Altera® Cyclone® V SoC FPGA with certified cloud connectivity to providers like Microsoft Azure. It includes wireless communication via Wi-Fi and Bluetooth, plus sensors for ambient light, temperature, humidity, acceleration, and gyroscopic motion. With open-source design examples, users can quickly learn to connect FPGA-based edge devices to the cloud, collect and analyze IoT data, and build responsive, reconfigurable smart edge solutions.

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Key Features

  • Built on DE10‑Nano with Altera® Cyclone® V SoC FPGA
  • Cloud service certification
  • Wireless connectivity via ESP32 module
  • Multi-sensor suite onboard
  • Developer-ready package
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Offering Brief

Offering Brief

Device Family Cyclone® V SE SoC FPGA
Offering Status Production
Device OPN(s) on Board 5CSEBA6U23C7N
Form Factor 68.6x107mm
Power 5V
Interfaces HDMI TX, Gigabit Ethernet, Accelerometer, USB OTG, Wi-Fi, Classic Bluetooth (BT) and Bluetooth Low Energy(BLE), 9-axis sensor, Ambient light sensor, UART to USB
Memory 1GB DDR3, EPCS64, Micro SD card socket
Connectors 40-pin expansion headers, One 10-pin Analog input, LTC 2x7 expansion header, Arduino expansion header
Switches & LEDs Reset Button, Power Button, Power LED, User-Programmable LEDs, Switch and Button
Latest Quartus Version Supported 20.1.1

Documents

System CD

Ordering Information

P0737

from Direct

$314.00

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