partner-offering-banner.png

Agilex™ 3 SoC FPGA SoM: iG-G71M

iWave Global

Select

The Agilex™ 3 is a compact, power-efficient System on Module (SoM) built on Agilex™ 3 C-Series FPGA architecture, featuring the M16A package and supporting Group C devices such as A3C100 and A3C135. With a dual-core Arm® Cortex®-A55 processor operating at up to 800 MHz, the SoM provides up to 135K logic elements and integrates 4 GTS transceivers supporting up to 12.5Gbps for high-speed connectivity. Designed for performance at the edge, it comes equipped with 2GB LPDDR4 (expandable up to 8GB), 32GB eMMC (expandable to 128GB), and onboard QSPI Flash, making it an ideal platform for industrial, embedded vision, and low-power computing applications.

The module features a rich set of interfaces including USB 3.1, RGMII Ethernet, USB 2.0 OTG, I2C, UART, and SD, along with 60 pairs of FPGA high-speed I/Os, 32 HVIOs, and dual 240-pin board-to-board connectors for flexible system integration. With integrated 2.5G Ethernet PHY, USB ULPI transceiver, and clock syn...

The Agilex™ 3 is a compact, power-efficient System on Module (SoM) built on Agilex™ 3 C-Series FPGA architecture, featuring the M16A package and supporting Group C devices such as A3C100 and A3C135. With a dual-core Arm® Cortex®-A55 processor operating at up to 800 MHz, the SoM provides up to 135K logic elements and integrates 4 GTS transceivers supporting up to 12.5Gbps for high-speed connectivity. Designed for performance at the edge, it comes equipped with 2GB LPDDR4 (expandable up to 8GB), 32GB eMMC (expandable to 128GB), and onboard QSPI Flash, making it an ideal platform for industrial, embedded vision, and low-power computing applications.

The module features a rich set of interfaces including USB 3.1, RGMII Ethernet, USB 2.0 OTG, I2C, UART, and SD, along with 60 pairs of FPGA high-speed I/Os, 32 HVIOs, and dual 240-pin board-to-board connectors for flexible system integration. With integrated 2.5G Ethernet PHY, USB ULPI transceiver, and clock synthesizer, the G71M ensures a complete solution for next-generation edge designs. Measuring just 50mm x 60mm, and supporting Linux BSP, the SoM is REACH and RoHS3 compliant and rated for extended temperature operation (0°C to +85°C), making it an ideal choice for space-constrained, compute-intensive industrial environments.

Key Features

  • Agilex™ 3 C-Series family with M16A Package
  • HPS LPDDR4 – 32bit 4GB (Expandable up to 8GB)
  • 32GB eMMC Flash (Expandable up to 128GB), 1Gb QSPI Flash
  • 4 x Transceivers up to 12.5Gbps
  • Up to 135,110 Logic Elements
  • PCIe Gen3 connectivity interface
  • Form Factor is 50mm x 60mm
Expand Close
Keyfeatures main image

Offering Brief

Offering Brief

Device Family Agilex® 3 FPGAs and SoC FPGAs C-Series
Offering Status Sampling
Device OPN(s) on Board A3CW135BM16AI6S;A3CW135BM16AE6SR0
Form Factor 60mm x 50mm (REN)
Power 5V
Interfaces From FPGA: 4 x GTS transceivers up to 12.5Gbps,
FPGA HSIO 60 pair/120SE IOs and 32 HVIOs
From HPS: RGMII, USB2.0 OTG, Debug UART,
I2C, SD (Opt), SPI (Opt)
From SDM: JTAG, AS, AVST (Opt)
From HPS to FPGA: 2.5G Ethernet(On-SOM),
USB 3.1, I2C
Memory HPS LPDDR4 – 32bit 2GB (Expandable up to 8GB), 32GB eMMC (Expandable up to 128GB), 1Gb QSPI Flash
Connectors 2 x 240 pin Board to Board Connectors
Switches & LEDs Boot switch and Statues LED
Latest Quartus Version Supported 25.1.1

System on Module

Ordering Information

Documentation & Resources

Market Segment and Sub-Segments