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Lotus Microsystems

About Lotus Microsystems

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Member

Certified Engineers

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Languages

Arabic, English, German, Mandarin Chinese

Lotus Microsystems develops advanced power delivery solutions for next-generation computing platforms. We design high-performance integrated power modules that combine advanced packaging technology, novel power converter architectures, and our proprietary silicon power interposer technology to achieve superior power density, thermal performance, and scalability.

Our technology originates from research in nanofabrication, power electronics, and integrated circuit design conducted at leading institutions including the Technical University of Denmark (DTU), Harvard University, Fraunhofer, and IMEC. This strong foundation in research and engineering excellence continues to shape our approach to innovation and product development.

Through close collaboration with global semiconductor partners, Lotus Microsystems delivers solutions that redefine how power is managed in high-performance computing and advanced electronic systems. The company operates from its headquarters in Copenhagen, Denmark, with a subsidiary in Cairo, Egypt.

Headquarters: Stamholmen 151, Hvidovre, 2650, Denmark

Offering Type

Offerings

LTG devices from Lotus Microsystems are thermally conductive yet electrically isolated silicon-based thermal jumpers. These devices are designed to guide heat away from hot electronic components, such as between active devices and ground planes, without establishing an electrical connection. LTG devices significantly enhance thermal conductivity, particularly in situations with limited or no direct access to a ground plane or heatsink, such as in a high-side switch in a half-bridge configuration.

Silicon, used as an alternative to traditional ceramic materials in the construction of thermal jumpers, offers a cost-effective solution with high thermal conductivity and excellent thermomechanical properties, and is reliably processed. The incorporation of LTG devices improves circuit reliability and reduces the overall cost of the thermal management system. They are available in three standard EIA sizes (0201, 0402, 0603: