Note: For device drying or baking conditions, please refer to the higher temperature (125C +/10C, <5% RH) User Bake conditions stipulated in J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices.
Moisture/Reflow Sensitivity Classification
If a device is classified as MSL 1, it is not moisture sensitive and the device does not have to be dry packed again after the pack has been opened.
If a device is classified at a higher numerical level, it is moisture sensitive and must be dry packed in accordance with J-STD-033.
If a device is classified as Level 6, it is extremely moisture sensitive and the dry pack will not provide adequate protection.
Disclaimer
This search tool is designed to help you determine the moisture sensitivity level (MSL) value of an Altera device based on specified input parameters. The tool and MSL values contained herein are for classification level reference only and should not be used or relied upon for soldering or any other purposes. Please refer to the MSL on Intel packing labels to determine the criteria for baking prior to soldering. Although Altera makes every attempt to keep the information on this website current, we do not promise or guarantee that the information is correct, complete, or up-to-date. Altera may make changes to the materials at this site, or to the products described in them, at any time without notice. The tool provided at this site is provided on an “as-is” basis. Altera makes no representations, warranties or guarantees, express or implied, as to the calculator or its results, including as to the accuracy, completeness, or genuineness thereof, or suitability for any purpose other than as indicated above.